宍戸 信之

J-GLOBALへ         更新日: 16/11/21 09:39
 
アバター
研究者氏名
宍戸 信之
 
シシド ノブユキ
所属
北九州市環境エレクトロニクス研究所
部署
パワーエレクトロニクス信頼性研究室
職名
主任研究員
学位
博士(工学)(京都大学)
その他の所属
名古屋工業大学

経歴

 
2015年10月
 - 
現在
北九州市環境エレクトロニクス研究所 パワーエレクトロニクス信頼性研究室 主任研究員
 
2015年10月
 - 
現在
名古屋工業大学 大学院しくみ領域 産学官連携研究員
 
2010年4月
 - 
2015年9月
 名古屋工業大学大学院しくみ領域 特任研究員
 

Misc

 
Kozo Koiwa, Kozo Koiwa, Nobuyuki Shishido, Nobuyuki Shishido, Chuantong Chen, Masaki Omiya, Masaki Omiya, Shoji Kamiya, Shoji Kamiya, Hisashi Sato, Hisashi Sato, Masahiro Nishida, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Toshiaki Suzuki, Takeshi Nokuo, Takeshi Nokuo
Scripta Materialia   111 94-97   2016年1月
© 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.Micro scale torsion test method was developed to investigate continuous deformation behavior around initial yield point of copper single crystal structure. Continuous load-...
S. Kamiya, S. Kamiya, C. Chen, N. Shishido, N. Shishido, M. Omiya, M. Omiya, K. Koiwa, K. Koiwa, H. Sato, H. Sato, M. Nishida, M. Nishida, T. Suzuki, T. Nakamura, T. Nokuo, T. Nokuo, T. Suzuki, T. Suzuki
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference, IITC/MAM 2015   151-153   2015年11月
© 2015 IEEE.Local apparent strength of interface between copper and cap layer on top was diverse depending on the crystal orientation underneath. For a comprehension of this diversity, physical adhesion energy to separate the interface was evaluat...
Masaki Omiya, Masaki Omiya, Shoji Kamiya, Shoji Kamiya, Nobuyuki Shishido, Nobuyuki Shishido, Kozo Koiwa, Kozo Koiwa, Hisashi Sato, Hisashi Sato, Masahiro Nishida, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Toshiaki Suzuki, Takeshi Nokuo, Takeshi Nokuo
IEEE International Reliability Physics Symposium Proceedings   2015-May    2015年1月
© 2015 IEEE.This paper describes the critical importance of interfacial strength between copper lines and cap layer for catastrophic failure due to chip-package interaction (CPI). Recently, copper interconnects and insulating layers are stacked al...
Chuantong Chen, Kozo Koiwa, Kozo Koiwa, Nobuyuki Shishido, Nobuyuki Shishido, Shoji Kamiya, Shoji Kamiya, Masaki Omiya, Masaki Omiya, Hisashi Sato, Hisashi Sato, Masahiro Nishida, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Takeshi Nokuo, Tadahiro Nagasawa
Engineering Fracture Mechanics   131 371-381   2014年12月
© 2014 Elsevier Ltd.A specimen size effect on the adhesion strength of Cu/insulation layer interface was studied by means of a new elastic-plastic finite element simulation technique. By considering the influence of the plastic zone at the interfa...
Nobuyuki Shishido, Nobuyuki Shishido, Yuka Oura, Hisashi Sato, Hisashi Sato, Shoji Kamiya, Shoji Kamiya, Kozo Koiwa, Kozo Koiwa, Masaki Omiya, Masaki Omiya, Masahiro Nishida, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Takeshi Nokuo, Toshiaki Suzuki, Toshiaki Suzuki
Microelectronic Engineering   120 71-76   2014年5月
Local adhesion strength of the interface composed of a single copper grain and SiN insulation layer was evaluated by using subgrain-scale specimens fabricated on a damascene interconnect structure. Crystallographic information was also surveyed at...