shishido nobuyuki
(宍戸 信之)
Modified on: 04/23
Profile Information
- Affiliation
- Faculty of Science and Engineering, Department of Mechanical Engineering, Kindai University
- Degree
-
博士(工学)(京都大学)
- Researcher number
- 00570235
- ORCID ID
- https://orcid.org/0000-0001-6710-6676
- J-GLOBAL ID
- 201501057217310927
- researchmap Member ID
- 7000010791
Research Areas
1Research History
6-
Feb, 2016 - Mar, 2020
-
Oct, 2015 - Mar, 2020
-
Oct, 2015 - Mar, 2017
-
Apr, 2010 - Sep, 2015
Awards
4Papers
21-
Power Electronic Devices and Components, 7, Apr, 2024
-
Journal of The Japan Institute of Electronics Packaging, 25(3) 260-268, May 1, 2022 Peer-reviewed
-
Nanomaterials, 11(9), Sep, 2021 Peer-reviewed
-
Journal of Japan Institute of Electronics Packaging, 24(6) 586-594, Sep 1, 2021 Peer-reviewed
-
MICROELECTRONICS RELIABILITY, 123, Aug, 2021 Peer-reviewedLead author
-
INTERNATIONAL JOURNAL OF PRESSURE VESSELS AND PIPING, 191, Jun, 2021 Peer-reviewed
-
THIN SOLID FILMS, 694, Jan, 2020 Peer-reviewed
-
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 7(3) 1604-1614, Sep, 2019 Peer-reviewedLead author
-
PARTICLE & PARTICLE SYSTEMS CHARACTERIZATION, 35(7) 1800061-1800061, Jul, 2018 Peer-reviewed
-
SCRIPTA MATERIALIA, 111 94-97, Jan, 2016 Peer-reviewed
-
MATERIALS LETTERS, 136 362-365, Dec, 2014 Peer-reviewed
-
ENGINEERING FRACTURE MECHANICS, 131 371-381, Nov, 2014 Peer-reviewed
-
MICROELECTRONIC ENGINEERING, 120 52-58, May, 2014 Peer-reviewed
-
MICROELECTRONIC ENGINEERING, 120 71-76, May, 2014 Peer-reviewedLead author
-
MICROELECTRONICS RELIABILITY, 53(4) 612-621, Apr, 2013 Peer-reviewed
-
JAPANESE JOURNAL OF APPLIED PHYSICS, 52(4), Apr, 2013 Peer-reviewed
-
Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 79(799) 354-358, 2013 Peer-reviewed
-
MICROELECTRONICS RELIABILITY, 53(1) 145-153, Jan, 2013 Peer-reviewed
-
SURFACE & COATINGS TECHNOLOGY, 215 280-284, Jan, 2013 Peer-reviewed
-
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 75(759) 1516-1525, 2009 Peer-reviewed
Misc.
131-
Journal of Japan Institute of Electronics Packaging, 24(6) 560-571, Sep 1, 2021
-
JOURNAL OF ELECTRONIC PACKAGING, 143(2), Jun, 2021 Peer-reviewed
-
The Proceedings of The Computational Mechanics Conference, 2021.34 109, 2021
-
Proceedings of Microelectronics Symposium, 30 95-98, 2020
-
エレクトロニクス実装学術講演大会講演論文集, 34 5D2-01, 2020
-
Journal of Smart Processing, 9(5) 216-223, 2020 Peer-reviewed
-
Journal of Japan Institute of Electronics Packaging, 23(2) 173-191, 2020
-
Symposium on Microjoining and Assembly Technology in Electronics, 25th 119‐122, Jan 29, 2019
-
The Proceedings of Mechanical Engineering Congress, Japan, 2019 J22315, 2019
-
The Proceedings of The Computational Mechanics Conference, 2019.32 063, 2019
-
The Proceedings of The Computational Mechanics Conference, 2019.32 001, 2019
-
PCIM Europe Conference Proceedings, 104-108, 2019
-
日本セラミックス協会秋季シンポジウム講演予稿集(CD-ROM), 31st ROMBUNNO.1R27, Aug 27, 2018
-
日本セラミックス協会秋季シンポジウム講演予稿集(CD-ROM), 31st ROMBUNNO.1R26, Aug 27, 2018
-
日本機械学会東海支部総会講演会講演論文集(CD-ROM), 67th ROMBUNNO.722, Mar 13, 2018
-
応用物理学会春季学術講演会講演予稿集(CD-ROM), 65th ROMBUNNO.19p‐F104‐5-1998, Mar 5, 2018
-
Symposium on Microjoining and Assembly Technology in Electronics, 24th 79‐84, Jan 30, 2018
-
The Proceedings of Conference of Tokai Branch, 2018 722-722, 2018
Professional Memberships
3Research Projects
4-
Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (C), Japan Society for the Promotion of Science, Apr, 2019 - Mar, 2022
-
Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (C), Japan Society for the Promotion of Science, Apr, 2018 - Mar, 2021
-
Grants-in-Aid for Scientific Research Grant-in-Aid for Young Scientists (B), Grant-in-Aid for Young Scientists (B), Japan Society for the Promotion of Science, Apr, 2015 - Mar, 2017
-
Grants-in-Aid for Scientific Research Grant-in-Aid for Young Scientists (B), Grant-in-Aid for Young Scientists (B), Japan Society for the Promotion of Science, Apr, 2013 - Mar, 2015