TSUNETSUGU Hideki

Last updated: Feb 16, 2011 at 00:00
 
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Name
TSUNETSUGU Hideki
Affiliation
Matsue National College of Technology
Section
Department of Electrical Engineering
Job title
Professor
Degree
(BLANK)(Shinshu University)

Research Areas

 
 

Academic & Professional Experience

 
1975
 - 
2001
NTT Senior Research Engineer2001- Matsue National College of Technology Professor
 

Education

 
 
 - 
1975
Graduate School, Division of Engineering, Shinshu University
 

Misc

 
A new packaging technology using microsolder bumps for high-speed photoreceivers.
IEEE Trans. CPMT   15(4) 578-582   1992
Accurate stable high-speed interconnections using 20-to-30-um-diameter microsolder bumps
IEEE Trans. CPMT Part A   20(1) 76-82   1997
Flip chip bonding technique using transferred microsolder bumps
IEEE Trans. CPMT Part C   20(4) 327-334   1997
A packaging technology for an optical 90'-hybrid balanced receiver using a planar lightware circuit
IEEE Trans CPMT Part B   19(3) 569-574   1996
Ultra-high-speed GaAs MESFET IC modules using flip chip bonding
IEICE Trans ELECTRON   E82-C(3) 475-482   1999

Research Grants & Projects

 
Study on optoelectrical component for optical communication
The Other Research Programs
Project Year: 2001   
Study on human Communication
The Other Research Programs
Project Year: 2001