Yuji Ishida

J-GLOBAL         Last updated: Nov 16, 2019 at 15:36
 
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Name
Yuji Ishida
E-mail
ishidanishitech.ac.jp
Affiliation
Nishinippon Institute of Technology

Awards & Honors

 
Apr 2018
ASI Award, American Supply Institute
Winner: Ryuta Hidaka, Yuji Ishida and Mitsuo Hasebe
 
Oct 2007
”Inkjet Printing of Nickel Nanosized Particles for Metal-Induced Crystallization of Amorphous Silicon”, MNC(Microprocesses and Nanotechnology Conference)2006 Award for Outstanding Paper, The Japan Society of Applied Physics
Winner: Yuji Ishida、Gou Nakagawa and Tanemasa Asano
 

Published Papers

 
Preliminary Measurements of Electrical Micropitting in Grease-Lubricated Point Contacts
Kenji Sunahara,Yuji Ishida,Shinji Yamashita,Masaharu Yamamoto,Hiroshi Nishikawa,Kenji Matsuda and Motohiro Kaneta
Tribology Transactions   54(5) 730-735   Jun 2011   [Refereed]
Droplet Ejection Behavior in Electrostatic Inkjet Driving
Yuji Ishida,Keigo Sogabe,Shintaro Kai and Tanemasa Asano
Japanese Journal of Applied Physics   47(6) 5281-5286   Jun 2008   [Refereed]
Electrostatic Inkjet Printing of Carbon Nanotube for Cold Cathode Application
Satoshi Shigematsu,Yuji Ishida,Naotoshi Nakashima and Tanemasa Asano
Japanese Journal of Applied Physics (Vol. 47, No. 6, pp. 5281 - 5286)   47(6) 5109-5112   Jun 2008   [Refereed]
Monitoring Droplet Ejection and Landing in Electrospray with Electric Current and Acoustic Emission
Kazunori Hakiai,Yuji Ishida and Tanemasa Asan
Japanese Journal of Applied Physics Physics   47(4) 2279-2284   Apr 2008   [Refereed]
Inkjet Printing of Nickel Nanosized Particles for Metal-Induced Crystallization of Amorphous Silicon
Yuji Ishida,Gou Nakagawa and Tanemasa Asano
Japanese Journal of Applied Physics   46(9B) 6437-6443   Sep 2007   [Refereed]

Misc

 
Pitch of Washboard/Fluting (W/F) Pattern caused by Electrical Pitting
Kenji Sunahara,Satoshi Kitazaki,Yutaka Yamaguti,Masaharu Yamamoto,Yuji Ishida,Iwao Sasaki,Hiroshi Nishikawa and Kenji Matsuda
Proceedings of The 9th Advanced Forum on Tribology   P07   Apr 2018
Effect of Lubrication Regime on Washboard/Fluting Pattern Formation due to Electrical Pitting
Kenji Sunahara,Satoshi Kitazaki,Yutaka Yamaguti,Yuji Ishida, Iwao Sasaki,Hiroshi Nishikawa and Kenji Matsuda
Proceedings of Leeds-Lyon Symposium on Tribology      Sep 2016
Relationship between Mechanical and Electrical Properties of Cu Wire and Al Pad Bonding
Yuji Ishida and Kenji Sunahara
Proceedings of International Conference on Electronic Packaging   508-511   Apr 2016
Preventive Method of Electrical Pitting Using Lubricant
Kenji Sunahara,Yuji Ishida, Shinji Yamashita,Masaharu Yamamoto,Nobuhiko Ohno,Hiroshi Nishikawa, Kenji Matsuda and Motohiro Kaneta
Extended Abstract of Czeck-Japan Triboloty Workshop      Nov 2014
Reliability Evaluation of Bonding between Cu Wire and Al Pad
Yuji Ishida,Nobuhiko Ota and Shinji Yamashita
Proceedings of International Conference on Electronic Packaging   630-633   May 2014