2014年7月
Formation of slip bands in poly-crystalline nano-copper under high-cycle fatigue of fully-reversed loading
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- ,
- ,
- ,
- 巻
- 608
- 号
- 開始ページ
- 221
- 終了ページ
- 228
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.msea.2014.04.085
- 出版者・発行元
- ELSEVIER SCIENCE SA
The purpose of this study is to investigate the effects of a nano-scale stress-field on fatigue damage in a nano-copper component under fully-reversed and high-cycle loading. A resonant fatigue experiment is carried out for a cantilever micro-specimen that has a polycrystalline nano-Cu sandwiched by Si, Ti and SiN. Crystallographic slip bands associated with extrusion/intrusion of about 30 nm width, which is much finer than that in the bulk copper ( approximate to 1 mu m), are formed on the Cu surface owing to the high-cycle fatigue loading. The new finding, the ultra-fine extrusion/intrusion, suggests the existence of different fatigue damage mechanisms in the nano-Cu from that in a bulk counterpart. The slip bands appear only in a particular grain though some others possess slip systems with higher Schmid factor. Detailed stress analysis, taking into account the Cu grains and surrounding dissimilar materials (Si, Ti, SiN), indicates that they are formed at a slip system with the highest resolved shear stress, which is in nano-scale. The formation stress is much higher than that in a bulk. (C) 2014 Elsevier B.V. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/j.msea.2014.04.085
- ISSN : 0921-5093
- eISSN : 1873-4936
- Web of Science ID : WOS:000338404800028