2014年4月
Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field
ENGINEERING FRACTURE MECHANICS
- ,
- ,
- ,
- 巻
- 120
- 号
- 開始ページ
- 60
- 終了ページ
- 66
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.engfracmech.2014.02.001
- 出版者・発行元
- PERGAMON-ELSEVIER SCIENCE LTD
In order to investigate delamination crack initiation from an interfacial edge in nanoscale component with the singular stress field, we conduct mechanical experiments using four kinds of cantilever specimens with the nanoscale singular stress field at the copper/silicon nitride interface. The results reveal that regardless of the specimen dimensions, the critical magnitude of the plastic stress intensity parameter, K-interface (edge (c)), is constant (112 MPa m(0.179)) within the singular stress field range of approximately 25 nm. This indicates that in the nano-sized component, a delamination crack initiation is dominated by a nanoscale singular stress field near the interface edge. (C) 2014 Elsevier Ltd. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/j.engfracmech.2014.02.001
- ISSN : 0013-7944
- eISSN : 1873-7315
- Web of Science ID : WOS:000335611200005