江利口 浩二

Microplasma thruster powered by X-band microwaves 

J. Appl. Phys. 125 083301 2019年  査読有り

Characterization of the distribution of defects introduced by plasma exposure in Si substrate 

J. Vac. Sci. Technol. A 37(1) 011304-01 - 011304-10 2019年1月  査読有り

Characterization of electric-field enhancement leading to circuit-layout dependent damage of low-k films when exposed to processing plasma 

J. Appl. Phys. 126 083304 2019年  査読有り

Investigation of spatial and energy profiles of plasma process-induced latent defects in Si substrate using capacitance-voltage characteristics 

J. Phys. D: Applied Physics 52 455102 2019年  査読有り

Characterization of surface modification mechanisms for boron nitride films under plasma exposure 

Surface and Coatings Technol. 377 124854 2019年  査読有り

Formation of superhard c-BN films on the body and edge of cutting tools by reactive plasma-assisted coating (RePAC) 

The 16th International Conference on Precision Engineering 941-8147 2016年11月  査読有り

Distribution Projecting the Reliability for 40 nm ReRAM and beyond based on Stochastic Differential Equation 

IEEE Tech. Dig. of Int. Electron Device Meet. (IEDM) 177 - 180 2015年12月  査読有り

Experimental demonstration of oblique ion incidence with sheath control plates during plasma etching of silicon 

Proc. 37th International Symposium on Dry Process (DPS) 13 - 14 2015年11月  査読有り

Silicon Nanowire Groeth on Si and SiO2 Substrate by Plasma Sputtering 

Proc. 37th International Symposium on Dry Process (DPS) 139 - 140 2015年11月  査読有り

Surface orientation dependence of plasma-induced ion bombardment damage in Si substrate 

Proc. 37th International Symposium on Dry Process (DPS) 211 - 212 2015年11月  査読有り

最新 実用真空技術総覧 

(株)エヌ・ティー・エス, 2019  2019年2月 

先端CMOS/メモリデバイスにおけるプラズマ加工技術の現状と課題 

応用物理 第87巻 第12号  2018年12月 

真空科学ハンドブック 

株式会社コロナ社(日本真空学会 編)  2018年2月 

プラズマプロセス技術 

森北出版株式会社  2017年 

プラズマプロセスの新しい応用 

ケミカルエンジニヤリング  2013年 

Characterization of dynamic behaviors of defects in Si substrates created by H2 plasma using conductance method 

41st International Symposium on Dry Process: DPS2019, November 21-22, 2019, JMS Aster plaza, Hiroshima, Japan 2019年11月 

Characterization of dynamic behaviors of carrier traps in silicon nitride films created by Ar and He plasma exposures 

International Workshop on DIELECTRIC THIN FILMS FOR FUTURE ELECTRON DEVICES – SCIENCE AND TECHNOLOGY – : IWDTF2019, November 18-20, Multi-Purpose Digital Hall, Tokyo Institute of Technology, Tokyo, Japan, S1-1 (2019) 2019年11月 

Modeling and controlling of defect generation in electronic devices during plasma etching processes—an optimization methodology of plasma-induced damage 

The 72nd Annual Gaseous Electronics Conference (GEC), October 28-November 01, 2019, the Texas A&M Hotel and Conference Center in College Station, Texas, DT2-3 (Oct. 29, 2019) 2019年10月   招待有り

Comprehensive Reconsideration of Material Property Modification by Processing Plasma Exposure and Its Optimal Control Strategy 

32nd International Microprocesses and Nanotechnology Conference: MNC2019, Octorber 28-31, 2019, International Conference Center Hiroshima, Hiroshima, Japan. (2019) 2019年10月 

Impacts of plasma process-induced damage on future devices 

The 12th Asian-European International Conference on Plasma Surface Engineering– AEPSE2019. S3-KN01, Sept. 02-05, Jeju Isand, Korea 2019年9月   招待有り