江利口 浩二

Characterization of dynamic behaviors of defects in Si substrates created by H2 plasma using conductance method 

Japanese Journal of Applied Physics 59(SJ) SJJC02 - SJJC02 2020年6月1日  査読有り最終著者

Evaluation of residual defects created by plasma exposure of Si substrates using vertical and lateral pn junctions 

JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY B 38(1) 2019年12月  査読有り

Microplasma thruster powered by X-band microwaves 

J. Appl. Phys. 125 083301 2019年  査読有り

Characterization of the distribution of defects introduced by plasma exposure in Si substrate 

J. Vac. Sci. Technol. A 37(1) 011304-01 - 011304-10 2019年1月  査読有り

Characterization of electric-field enhancement leading to circuit-layout dependent damage of low-k films when exposed to processing plasma 

J. Appl. Phys. 126 083304 2019年  査読有り

先端CMOS/メモリデバイスにおけるプラズマ加工技術の現状と課題 

応用物理 87(12) 895 - 901 2018年12月  招待有り

Formation of superhard c-BN films on the body and edge of cutting tools by reactive plasma-assisted coating (RePAC) 

The 16th International Conference on Precision Engineering 941-8147 2016年11月  査読有り

Experimental demonstration of oblique ion incidence with sheath control plates during plasma etching of silicon 

Proc. 37th International Symposium on Dry Process (DPS) 13 - 14 2015年11月  査読有り

Silicon Nanowire Groeth on Si and SiO2 Substrate by Plasma Sputtering 

Proc. 37th International Symposium on Dry Process (DPS) 139 - 140 2015年11月  査読有り

最新 実用真空技術総覧 

(株)エヌ・ティー・エス, 2019  2019年2月 

先端CMOS/メモリデバイスにおけるプラズマ加工技術の現状と課題 

応用物理 第87巻 第12号  2018年12月 

真空科学ハンドブック 

株式会社コロナ社(日本真空学会 編)  2018年2月 

プラズマプロセス技術 

森北出版株式会社  2017年 

プラズマプロセスの新しい応用 

ケミカルエンジニヤリング  2013年 

Plasma-induced Damage-modeling, Characterizations, and Design Methodologies 

IEEE Int. Reliability Physics Symp (IRPS) 2020年5月   招待有り

Characterization of dynamic behaviors of defects in Si substrates created by H2 plasma using conductance method 

41st International Symposium on Dry Process: DPS2019, November 21-22, 2019, JMS Aster plaza, Hiroshima, Japan 2019年11月 

Characterization of dynamic behaviors of carrier traps in silicon nitride films created by Ar and He plasma exposures 

International Workshop on DIELECTRIC THIN FILMS FOR FUTURE ELECTRON DEVICES – SCIENCE AND TECHNOLOGY – : IWDTF2019, November 18-20, Multi-Purpose Digital Hall, Tokyo Institute of Technology, Tokyo, Japan, S1-1 (2019) 2019年11月 

Modeling and controlling of defect generation in electronic devices during plasma etching processes—an optimization methodology of plasma-induced damage 

The 72nd Annual Gaseous Electronics Conference (GEC), October 28-November 01, 2019, the Texas A&M Hotel and Conference Center in College Station, Texas, DT2-3 (Oct. 29, 2019) 2019年10月   招待有り

Comprehensive Reconsideration of Material Property Modification by Processing Plasma Exposure and Its Optimal Control Strategy 

32nd International Microprocesses and Nanotechnology Conference: MNC2019, Octorber 28-31, 2019, International Conference Center Hiroshima, Hiroshima, Japan. (2019) 2019年10月