江利口 浩二

Evaluation methodology for assessment of dielectric degradation and breakdown dynamics using time-dependent impedance spectroscopy (TDIS) 

IEEE Int. Reliability Physics Symp (IRPS) 2021年3月24日

Plasma-induced Damage—Modeling and Characterizations 

International Symposium on Semiconductor Manufacturing (ISSM 2020) 2020年12月15日  招待有り

Characterization Scheme for Plasma-Induced Defect due to Stochastic Lateral Straggling in Si Substrates for Ultra-Low Leakage Devices 

IEEE International Electron Devices Meeting (IEDM) 2020年12月14日

Model analysis for effects of spatial and energy profiles of plasma process-induced defects in Si substrate on MOS device performance 

International Conference on Simulation of Semiconductor Processes and Devices 2020年10月6日

Plasma-induced Damage-modeling, Characterizations, and Design Methodologies 

IEEE Int. Reliability Physics Symp (IRPS) 2020年5月  招待有り

Characterization of dynamic behaviors of defects in Si substrates created by H2 plasma using conductance method 

41st International Symposium on Dry Process: DPS2019, November 21-22, 2019, JMS Aster plaza, Hiroshima, Japan 2019年11月

Characterization of dynamic behaviors of carrier traps in silicon nitride films created by Ar and He plasma exposures 

International Workshop on DIELECTRIC THIN FILMS FOR FUTURE ELECTRON DEVICES – SCIENCE AND TECHNOLOGY – : IWDTF2019, November 18-20, Multi-Purpose Digital Hall, Tokyo Institute of Technology, Tokyo, Japan, S1-1 (2019) 2019年11月

Modeling and controlling of defect generation in electronic devices during plasma etching processes—an optimization methodology of plasma-induced damage 

The 72nd Annual Gaseous Electronics Conference (GEC), October 28-November 01, 2019, the Texas A&M Hotel and Conference Center in College Station, Texas, DT2-3 (Oct. 29, 2019) 2019年10月  招待有り

Comprehensive Reconsideration of Material Property Modification by Processing Plasma Exposure and Its Optimal Control Strategy 

32nd International Microprocesses and Nanotechnology Conference: MNC2019, Octorber 28-31, 2019, International Conference Center Hiroshima, Hiroshima, Japan. (2019) 2019年10月

Impacts of plasma process-induced damage on future devices 

The 12th Asian-European International Conference on Plasma Surface Engineering– AEPSE2019. S3-KN01, Sept. 02-05, Jeju Isand, Korea 2019年9月  招待有り

Effects of Variability in Plasma-Induced Damage to Si Substrate on Device Performance and Its Application to Variability Assessment Methodology 

51st International Conference on Solid State Devices and Materials: SSDM2019 2019年9月

Characterization of Surface Modification Mechanisms for Boron Nitride Films under Plasma Exposure 

ICMCTF-46 2019 2019年5月23日

プラズマプロセスにおける欠陥形成過程のモデリングと予測 

第206回応用物理学会シリコンテクノロジー分科会研究会 2018年2月9日  招待有り

Defect Generation in Si substrates during Plasma Processing 

17th International Workshop on Junction Technology 2017 2017年6月2日  招待有り

Model prediction of stochastic effects of plasma-induced damage in advanced electronic devices 

6th International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors 2017年5月24日  招待有り

Impacts of plasma process-induced damage on MOSFET parameter variability and reliability 

The 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis 2015年10月7日  招待有り

Modeling of Plasma‐induced Damage in Advanced Transistors in ULSI Circuits 

Semicon Korea - S4. Plasma Science and Etching Technology 2015年2月5日 SEMI  招待有り

Modeling of plasma-induced damage during the etching of ultimately-scaled transistors in ULSI circuits—A model prediction of damage in three dimensional structures— 

67th Annual Gaseous Electronics Conference 2014年11月4日 American Physical Society  招待有り