2011年12月
Cohesive zone criterion for cracking along the Cu/Si interface in nanoscale components
ENGINEERING FRACTURE MECHANICS
- ,
- ,
- ,
- 巻
- 78
- 号
- 17
- 開始ページ
- 2935
- 終了ページ
- 2946
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.engfracmech.2011.08.010
- 出版者・発行元
- PERGAMON-ELSEVIER SCIENCE LTD
Crack initiation and propagation along the Cu/Si interface in multilayered films (Si/Cu/SiN) with different thicknesses of the Cu layer (20 and 200 nm) are experimentally investigated using a nano-cantilever and millimeter-sized four-point bending specimens. To examine the cohesive zone model (CZM) criterion for interfacial delamination along the Cu/Si interface in nanoscale stress concentration, an exponential type of CZM is utilized to simulate the observed delamination processes using the finite element method. After the CZM parameters for the Cu/Si interface are calibrated by experiment, interface cracking in other experiments is predicted. This indicates that the CZM criterion is universally applicable for describing cracking along the interface regardless of specimen dimensions and film thickness which include the differences in plastic behavior and residual stress. The CZM criterion can also predict interfacial cracking along Cu/Si interfaces with different stress singularities. (C) 2011 Elsevier Ltd. All rights reserved.
- リンク情報
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- DOI
- https://doi.org/10.1016/j.engfracmech.2011.08.010
- J-GLOBAL
- https://jglobal.jst.go.jp/detail?JGLOBAL_ID=201102243879650950
- CiNii Articles
- http://ci.nii.ac.jp/naid/80022287863
- Web of Science
- https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000301734000008&DestApp=WOS_CPL
- ID情報
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- DOI : 10.1016/j.engfracmech.2011.08.010
- ISSN : 0013-7944
- J-Global ID : 201102243879650950
- CiNii Articles ID : 80022287863
- Web of Science ID : WOS:000301734000008