Research Projects

2021 - Mar, 2024

化合物半導体横方向ヘテロ接合の創成とその電子デバイスへの応用

日本学術振興会  科学研究費補助金  基盤研究(B)(一般)

Grant number
21H01384
Japan Grant Number (JGN)
JP21H01384
Authorship
Coinvestigator(s)
Grant amount
(Total)
17,420,000 Japanese Yen
(Direct funding)
13,400,000 Japanese Yen
(Indirect funding)
4,020,000 Japanese Yen

Link information
KAKEN
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-21H01384
ID information
  • Grant number : 21H01384
  • Japan Grant Number (JGN) : JP21H01384