井上史大 (Fumihiro INOUE) - マイポータル

基本情報

所属: 横浜国立大学工学研究院准教授

研究者番号: 00908303
ORCID iD: https://orcid.org/0000-0003-2292-846X
J-GLOBAL ID: 202101011495564458
researchmap会員ID: R000020166

外部リンク: https://inoue.ynu.ac.jp/

研究キーワード

研究分野

経歴

2011年3月 - 2021年3月

imec
2013年3月 - 2014年10月

東北大学

メディア報道

IEEE国際賞、横浜国立大学の井上史大准教授が日本人初受賞

https://univ-journal.jp/171520/ 2022年7月インターネットメディア
横滨国立大学井上副教授荣获IEEE国际奖杰出青年工程师奖，为日本人首位

https://www.keguanjp.com/kgjp_keji/kgjp_kj_etc/pt20220711000003.html

受賞

委員歴

2021年10月

ADMETA Committee Member
2021年5月

ICEP Technical Program Committee Member
2021年5月

IITC Committee Member

論文

D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations

Kentaro Mihara, Takashi Hare, Hirofumi Sakai, Shimpei Aoki, Toyoharu Terada, Mariappan Murugesan, Hiryuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima …

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 60 420-426 2024年5月28日
Origin of Voids at the SiO<inf>2</inf>/SiO<inf>2</inf> and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance

F. Nagano, F. Inoue, A. Phommahaxay, L. Peng, F. Chancerel, H. Naser, G. Beyer, A. Uedono, E. Beyne, S. De. Gendt …

ECS Journal of Solid State Science and Technology 12(3) 2023年3月
Robust Measurement of Bonding Strength for Wafer-to-Wafer 3D Integration

Junya Fuse, Tomoya Iwata, Sodai Ebiko, Fumihiro Inoue

2023 International Conference on Electronics Packaging, ICEP 2023 105-106 2023年
Surface Topography Control on Cu Pad for Hybrid Bonding

Kohei Nakayama, Tomoya Iwata, Sodai Ebiko, La Thi Ngoc Mai, Ken Harada, Masahiro Yokoyama, Yasuhiro Kawase, Fumihiro Inoue

2023 IEEE International Interconnect Technology Conference and IEEE Materials for Advanced Metallization Conference, IITC/MAM 2023 - Proceedings 2023年
Inorganic Temporary Direct Bonding for Collective Die to Wafer Hybrid Bonding

Fumihiro Inoue, Shunsuke Teranishi, Tomoya Iwata, Koki Onishi, Naoko Yamamoto, Akihito Kawai, Shimpei Aoki, Takashi Hare, Akira Uedono

Proceedings - Electronic Components and Technology Conference 2023-May 556-563 2023年
Void Formation Mechanism Related to Particles during Wafer-to-Wafer Direct Bonding

F. Nagano, S. Iacovo, A. Phommahaxay, F. Inoue, F. Chancerel, H. Naser, G. Beyer, E. Beyne, S. De. Gendt

ECS Journal of Solid State Science and Technology 11(6) 2022年6月
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding

Kimoon Park, Fumihiro Inoue, Jaber Derakhshandeh, Bongyoung Yoo

JAPANESE JOURNAL OF APPLIED PHYSICS 61(4) 2022年4月
Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging

Fumihiro Inoue, Alain Phommahaxay, Yohei Gokita, Berthold Moeller, Eric Beyne

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 119(5-6) 3427-3435 2022年3月
Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Fumihiro Inoue, Serena Iacovo, Zaid El-Mekki, Soon-Wook Kim, Herbert Struyf, Eric Beyne

IEEE ELECTRON DEVICE LETTERS 42(12) 1826-1829 2021年12月
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration

Fumihiro Inoue, Jaber Derakhshandeh, Melina Lofrano, Eric Beyne

JAPANESE JOURNAL OF APPLIED PHYSICS 60(2) 2021年2月
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding

Serena Iacovo, Lan Peng, Fuya Nagano, Thomas Uhrmann, Jurgen Burggraf, Andreas Fehkuhrer, Thierry Conard, Fumihiro Inoue, Soon-Wook Kim, Joeri De Vos …

IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) 2097-2104 2021年
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

Fumihiro Inoue, Jaber Derakhshandeh, Carine Gerets, Eric Beyne

2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021) 9-10 2021年
Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

Fumihiro Inoue, Arnita Podpod, Lan Peng, Alain Phommahaxay, Kenneth June Rebibis, Akira Uedono, Eric Beyne

JOURNAL OF MANUFACTURING PROCESSES 58 811-818 2020年10月
10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Jaber Derakhshandeh, Giovanni Capuz, Vladimir Cherman, Fumihiro Inoue, Inge De Preter, Lin Hou, Pieter Bex, Carine Gerets, Fabrice Duval, Tomas Webers …

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) 617-622 2020年
Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications

Nagano, F., Iacovo, S., Phommahaxay, A., Inoue, F., Sleeckx, E., Beyer, G., Beyne, E., De. Gendt, S.

ECS Journal of Solid State Science and Technology 9(12) 2020年
Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Fumihiro Inoue, Lan Peng, Serena Iacovo, Alain Phommahaxay, Patrick Verdonck, Johan Meersschaut, Praveen Dara, Erik Sleeckx, Andy Miller, Gerald Beyer …

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY 8(6) P346-P350 2019年6月
Direct bonding of low temperature heterogeneous dielectrics

Serena Iacovo, Lan Peng, Alain Phommahaxay, Fumihiro Inoue, Patrick Verdonck, Soon-Wook Kim, Erik Sleeckx, Andy Miller, Gerald Beyer, Eric Beyne

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 2206-2212 2019年
Defect Identification in Bonding Surface Layers by Positron Annihilation Spectroscopy

Fumihiro Inoue, Lan Peng, Serena Iacovo, Fuya Nagano, Erik Sleeckx, Gerald Beyer, Akira Uedono, Eric Beyne

PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 15-15 2019年
Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding

Fumihiro Inoue, Alain Phommahaxay, Arnita Podpod, Samuel Suhard, Erik Sleeckx, Kenneth June Rebibis, Andy Miller, Eric Beyne, Hitoshi Hoshino, Berthold Moeller

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 437-445 2019年
Pre-bonding Characterization of SiCN Enabled Wafer Stacking

Lan Peng, Soon-Wook. Kim, Serena Iacovo, Fumihiro Inoue, Joeri De Vos, Erik Sleeckx, Andy Miller, Gerald Beyer, Eric Beyne

PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) 14-14 2019年

もっとみる

MISC

ウエハ薄化技術

井上史大

エレクトロニクス実装学会誌 26(1) 172-177 2023年1月1日

共同研究・競争的資金等の研究課題

原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用

日本学術振興会科学研究費助成事業基盤研究(B) 2023年4月 - 2026年3月

井上史大, 藤野真久
3Dチップレット型ヘテロ量子デバイスの創生

科学技術振興機構戦略的な研究開発の推進戦略的創造研究推進事業さきがけ 2022年 - 2025年

井上史大
ボトムアップ型選択成長技術のハイブリッド接合への応用

日本学術振興会科学研究費助成事業研究活動スタート支援 2021年8月 - 2023年3月

井上史大

井上史大

基本情報

研究キーワード

研究分野

経歴

メディア報道

受賞

委員歴

論文

MISC

共同研究・競争的資金等の研究課題

メニュー

共著者の一覧