論文

査読有り 筆頭著者 責任著者
2003年8月

Formation of Porous silicon by metal particle enhanced chemical etching in HF solution and its application for efficient solar cells “jointly worked”

ELECTROCHEMISTRY COMMUNICATIONS
  • YAE S
  • ,
  • KAWAMOTO Y
  • ,
  • TANAKA H
  • ,
  • FUKUMURO N
  • ,
  • MATSUDA H

5
8
開始ページ
632
終了ページ
636
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/S1388-2481(03)00146-2

Porous Si was formed on n-Si wafers, modified with fine Pt particles, by simply immersing the wafers in a HF solution without a bias or an oxidizing agent. The Pt particles were deposited onto n-Si wafers by electrodeposition or electroless displacement deposition. SEM images show that many pores, ranging between 0.1 and 0.8 μm in diameter and covered with a luminescent nanoporous layer, were formed only on the Pt-modified area of the n-Si surface by immersion in 7.3 M HF solution for 24 h. The weight loss of Pt-electrodeposited n-Si wafer was 0.46 mg cm -2 , corresponding to ca. 2 μm in thickness. The weight loss and the structure of porous Si changed with the etching conditions, such as concentration of dissolved oxygen in the HF solution, distribution density of metal particles, and different kinds of metal particles. A photoelectrochemical solar cell equipped with a Pt-particle-modified porous n-Si electrode gave 13.3 mW cm -2 of maximum output power, which corresponds to a 13% conversion efficiency and is higher than that for the Pt-particle-modified flat n-Si electrode. ©2003 Elsevier Science B.V. All rights reserved.

リンク情報
DOI
https://doi.org/10.1016/S1388-2481(03)00146-2
CiNii Articles
http://ci.nii.ac.jp/naid/80016058360
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000184670200003&DestApp=WOS_CPL
URL
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=0043131861&origin=inward
ID情報
  • DOI : 10.1016/S1388-2481(03)00146-2
  • ISSN : 1388-2481
  • CiNii Articles ID : 80016058360
  • ORCIDのPut Code : 85262769
  • SCOPUS ID : 0043131861
  • Web of Science ID : WOS:000184670200003

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