論文

査読有り
2017年

Influence of adhesion area, applied voltage, and adherend materials on residual strength of joints bonded with electrically dismantlable adhesive

Journal of Adhesion
  • Shiote, H.
  • ,
  • Sekiguchi, Y.
  • ,
  • Ohe, M.
  • ,
  • Sato, C.

93
10
開始ページ
831
終了ページ
854
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1080/00218464.2017.1305900
出版者・発行元
TAYLOR & FRANCIS LTD

The separation characteristics of an electrically dismantlable adhesive, ElectRelease, were experimentally investigated. The adhesive has a strength that decreases by applying voltage. The residual strengths of cylindrical butt joints bonded with the adhesive were measured after voltage application. Various experiments were carried out in order to investigate the influences of the bonding area and the type of adherend materials on the residual strength by changing the dimensions and material of the adherends. The influence of constant voltage and current applications was also examined. As a result, it was confirmed that the residual strength of a joint does not depend significantly on the bonding area but on the type of adherend material. The residual strength was able to be determined and predicted by using an areal density of the total charge passing through the bonding area. Higher applied voltage was able to accelerate the decay of the residual strength and shorten the time for a given decrease in strength. The constant current application also induced a decrease in joint strength, which also corresponded to the total charge that could easily be calculated from a duration for current application.

リンク情報
DOI
https://doi.org/10.1080/00218464.2017.1305900
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000407447100008&DestApp=WOS_CPL
Scopus Url
http://www.scopus.com/inward/record.url?eid=2-s2.0-85018813682&partnerID=MN8TOARS
URL
http://www.tandfonline.com/doi/full/10.1080/00218464.2017.1305900
ID情報
  • DOI : 10.1080/00218464.2017.1305900
  • ISSN : 0021-8464
  • eISSN : 1545-5823
  • ORCIDのPut Code : 79992456
  • SCOPUS ID : 85018813682
  • Web of Science ID : WOS:000407447100008

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