論文

査読有り
2014年

Visualization of Slurry Flow in Polishing Pad Asperity Area

2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT)
  • Akira Fukuda
  • ,
  • Masahito Mitarai

開始ページ
234
終了ページ
236
記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
出版者・発行元
IEEE

Various researchers have investigated the mechanism of chemical mechanical polishing (CMP). Although the slurry flow in a microscopic pad asperity is thought to play a critical role in the transport of abrasive particles to the wafer surface, this has not been completely explained. In this study, we devised a visualization method for the slurry flow in the pad asperity area, created an experimental apparatus for visualization, and attempted to obtain the flow velocity vector.

リンク情報
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000380459700059&DestApp=WOS_CPL
共同研究・競争的資金等の研究課題
CMPにおけるウェーハと研磨パッドとの間のスラリー流れに関する研究
URL
http://ieeexplore.ieee.org/abstract/document/7017288/
ID情報
  • Web of Science ID : WOS:000380459700059

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