2014年
Visualization of Slurry Flow in Polishing Pad Asperity Area
2014 INTERNATIONAL CONFERENCE ON PLANARIZATION/CMP TECHNOLOGY (ICPT)
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- 開始ページ
- 234
- 終了ページ
- 236
- 記述言語
- 英語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- 出版者・発行元
- IEEE
Various researchers have investigated the mechanism of chemical mechanical polishing (CMP). Although the slurry flow in a microscopic pad asperity is thought to play a critical role in the transport of abrasive particles to the wafer surface, this has not been completely explained. In this study, we devised a visualization method for the slurry flow in the pad asperity area, created an experimental apparatus for visualization, and attempted to obtain the flow velocity vector.
- リンク情報
- ID情報
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- Web of Science ID : WOS:000380459700059