論文

査読有り
2020年6月

Flexible substrate with floating island structure for mounting ultra-thin silicon chips

FLEXIBLE AND PRINTED ELECTRONICS
  • Toshihiro Takeshita
  • ,
  • Yusuke Takei
  • ,
  • Takahiro Yamashita
  • ,
  • Atsushi Oouchi
  • ,
  • Takeshi Kobayashi

担当区分
筆頭著者
5
2
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1088/2058-8585/ab7bc3
出版者・発行元
IOP PUBLISHING LTD

A flexible substrate with a novel floating island structure design was developed for mounting ultra-thin silicon chips. The structure reduced the strain propagated from the stretching base to the ultra-thin silicon chips. While conventional structures reduce strain by 64.2%, the floating island structure reduced strain by 90.2%. Furthermore, tests for operational stability and durability were conducted using an ultra-thin operational amplifier (OPAMP) mounted on the flexible substrate with a floating island structure, where the OPAMP was thinned to 30 mu m by chemical mechanical polishing. The ultra-thin OPAMP operated with no strain effects even when repeatedly stretched to 30% elongation. Also, the ultra-thin silicon chip mounted on the floating island structure demonstrated durability against >25 000 stretching cycles. This research is applicable for functional wearable devices using ultra-thin silicon chips and featuring high flexibility and stretchability.

Web of Science ® 被引用回数 : 1

リンク情報
DOI
https://doi.org/10.1088/2058-8585/ab7bc3
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000522217100001&DestApp=WOS_CPL

エクスポート
BibTeX RIS