論文

査読有り 最終著者
2010年

Intermetallic coating using a 3-dimensional micro welder

Materials Science Forum
  • Kiyotaka Matsuura
  • ,
  • Naoki Mizuta
  • ,
  • Soshu Kirihara
  • ,
  • Yoshinari Miyamoto
  • ,
  • Atsushi Yumoto

631-632
開始ページ
259
終了ページ
264
記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.4028/www.scientific.net/MSF.631-632.259
出版者・発行元
TRANS TECH PUBLICATIONS LTD

The authors have studied a new method of intermetallic coating using a small TIG welder. This method is based on a reaction between small liquid beads produced from very thin metal wire and the substrate metal surface. The authors designed a computer-aided 3-dimensional micro welder (3DMW) for a previous study on freeform fabrication of intermetallics, and have applied it to this study on intermetallic coating. In this study, a predetermined length of thin aluminum wire was fed onto the titanium substrate surface, and a spark was stricken from a thin electrode of a W-Ce2O3 alloy to make a small aluminum liquid bead on the titanium substrate surface and to simultaneously melt a small area of the substrate surface beneath the liquid bead. All process conditions had been programmed beforehand, including the length of the wire feeding per spark, the position of the electrode, electric power, movement of the stage holding the substrate, etc. The liquid bead containing aluminum and titanium rapidly solidified on the titanium substrate surface producing titanium aluminides on it. Repetition of the aluminum wire feeding, the electrode positioning and the spark striking produced a coating layer consisting of sub-layers of TiAl3, TiAl and Ti3Al from the surface side to the substrate side. Vickers hardness and wear resistance of the coated sample were remarkably improved. © (2010) Trans Tech Publications.

リンク情報
DOI
https://doi.org/10.4028/www.scientific.net/MSF.631-632.259
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000280584000041&DestApp=WOS_CPL
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=75849136052&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=75849136052&origin=inward
ID情報
  • DOI : 10.4028/www.scientific.net/MSF.631-632.259
  • ISSN : 0255-5476
  • eISSN : 1662-9752
  • SCOPUS ID : 75849136052
  • Web of Science ID : WOS:000280584000041

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