ベンアメド アクラム

NOMA: A Novel Reliability Improvement Methodology for 3D IC-Based Neuromorphic Systems 

IEEE Transactions on Components, Packaging and Manufacturing Technology 2025年11月  

Hardware Design and Evaluation of an FPGA-Based Network Switch Supporting Asynchronous Traffic Shaping for Time Sensitive Networking 

IEEE Access 12 2024年  

Power-Aware Neuromorphic Architecture With Partial Voltage Scaling 3-D Stacking Synaptic Memory 

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 31(12) 2023年  

HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems 

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 41(4) 2022年4月  

TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems 

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 28(3) 672-685 2020年3月  

A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems 

IEEE Access 8 166642-166657 2020年  

Scalable Design Methodology and Online Algorithm for TSV-Cluster Defects Recovery in Highly Reliable 3D-NoC Systems 

IEEE Transactions on Emerging Topics in Computing 8(3) 577-590 2020年  

A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip 

IEEE Access 8 59571-59589 2020年  

Asymmetric Body Bias Control With Low-Power FD-SOI Technologies: Modeling and Power Optimization 

IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26(7) 1254-1267 2018年7月  

Digitally Assisted On-Chip Body Bias Tuning Scheme for Ultra Low-Power VLSI Systems 

IEEE Transactions on Circuits and Systems I: Regular Papers 1-14 2018年  

Multi-Voltage Variable Pipeline Routers with the Same Clock Frequency for Low-Power Network-on-Chips Systems 

IEICE Transactions on Electronics E99C(8) 2016年