CHEN CHUANTONG
(陳 伝彤)
Modified on: 04/11
Profile Information
- Affiliation
- The Institute of Scientific and Industrial Research, Osaka University
- Contact information
- chenchuantong
sanken.osaka-u.ac.jp - J-GLOBAL ID
- 201801020238415240
- researchmap Member ID
- B000315785
- External link
Research Areas
2Research History
3-
Apr, 2020 - Present
-
Oct, 2016 - Mar, 2020
-
Apr, 2010 - Mar, 2012
Awards
8-
May, 2022
-
May, 2021
-
May, 2020
Papers
186-
Applied Surface Science, 660 159970-159970, Jul, 2024 Peer-reviewedCorresponding author
-
Materials & Design, 240 112863-112863, Apr, 2024 Peer-reviewedCorresponding author
-
Materials Letters, 361 136157-136157, Apr, 2024 Peer-reviewedCorresponding author
-
Materials Today Communications, 38 108507-108507, Mar, 2024 Peer-reviewedLast author
-
Journal of Materials Research and Technology, 29 2437-2447, Mar, 2024 Peer-reviewedLast author
-
Applied Surface Science, 159694-159694, Feb, 2024 Peer-reviewedCorresponding author
-
Journal of Materials Research and Technology, 28 3541-3565, Jan, 2024 Peer-reviewed
-
Materials Science and Engineering: A, 146089-146089, Jan, 2024 Peer-reviewed
-
Corrosion Science, 226 111614-111614, Jan, 2024 Peer-reviewedCorresponding author
-
Journal of Materials Processing Technology, 322 118207-118207, Dec, 2023 Peer-reviewed
-
Microelectronics Reliability, 150 115231-115231, Nov, 2023 Peer-reviewed
-
Microelectronics Reliability, 150 115105-115105, Nov, 2023 Peer-reviewed
-
Microelectronics Reliability, 149 115211-115211, Oct, 2023 Peer-reviewedCorresponding author
-
Journal of Materials Research and Technology, 26 7775-7788, Sep, 2023 Peer-reviewed
-
Journal of Materials Research and Technology, 26 1079-1093, Sep, 2023 Peer-reviewedCorresponding author
-
57Journal of Science: Advanced Materials and Devices, 8(3) 100606-100606, Sep, 2023 Peer-reviewedLead authorCorresponding author -
20Journal of Materials Research and Technology, 25 6323-6337, Jul, 2023 Peer-reviewedCorresponding author -
International Journal of Adhesion and Adhesives, 125 103419-103419, Jul, 2023 Peer-reviewedCorresponding author
-
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May, 2023 Peer-reviewed
-
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), May, 2023 Peer-reviewedLead authorCorresponding author
Misc.
10-
マイクロエレクトロニクスシンポジウム論文集, 33rd, 2023
-
Symposium on Microjoining and Assembly Technology in Electronics, 29th, 2023
-
Journal of The Japan Institute of Electronics Packaging, 24(5) 369-372, 2021
-
2020 IEEE 22ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 312-315, 2020
-
Proceedings of JIEP Annual Meeting, 32 47-50, 2018
-
Proceedings of JIEP Annual Meeting, 32 64-66, 2018
-
MES, 28 257-260, 2018
-
MES, 28 241-244, 2018
Books and Other Publications
6-
エヌ・ティー・エス, Feb, 2022 (ISBN: 9784860437671)
-
日刊工業新聞社, Feb, 2022
-
株式会社技術情報協会, Oct, 2021
-
Dec, 2020
-
株式会社技術情報協会, Mar, 2020
Presentations
36-
IEEE Electronic Components and Technology Conference (ECTC 2019, Las Vegas, Nevada USA)., Jun, 2019
-
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, (PCIM Europe Conference 2019, Nuremberg, Germany)., May, 2019
-
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, (PCIM Europe Conference 2019, Nuremberg, Germany)., May, 2019
-
International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, (PCIM Europe Conference 2019, Nuremberg, Germany), May, 2019
-
Intelligent Motion, Renewable Energy and Energy Management, (PCIM Europe Conference 2019, Nuremberg, Germany)., May, 2019
-
IEEE International Conference on Electronics Packaging (ICEP 2019, Nigata, Japan), Apr, 2019
-
20th IEEE International Conference on Electronic Materials and Packaging (EMAP2018, Hongkong, China)., Dec, 2018
-
20th IEEE International Conference on Electronic Materials and Packaging (EMAP2018, Hongkong, China)., Dec, 2018
-
20th IEEE International Conference on Electronic Packaging technology (ICEPT2018, Shanghai, China), Aug, 2018
-
20th IEEE International Conference on Electronic Packaging technology (ICEPT2018, Shanghai, China), Aug, 2018
-
20th IEEE International Conference on Electronic Packaging technology (ICEPT2018, Shanghai, China), Aug, 2018
-
IEEE Electronics Packaging Technology Conference (EPTC 2018), May, 2018
-
IEEE International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC2018, Mei, Japan), Apr, 2018
-
IEEE International Power Electronics Conference (IPEC-Niigata 2018, Japan), Apr, 2018
-
IEEE International Power Electronics Conference (IPEC-Niigata 2018, Japan), Apr, 2018
-
IEEE International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC2018, Mei, Japan)., Apr, 2018
-
Materials Science and Technology Annual Meeting (MS&T 2017)., Oct 8, 2017
-
18th IEEE International Conference on Electronic Packaging Technology (Harbin, China, 2017)., Aug, 2017
Professional Memberships
3Research Projects
11-
「官民による若手研究者発掘支援事業／共同研究フェーズ」, 国立研究開発法人新エネルギー・産業技術総合開発機構, Apr, 2022 - Mar, 2027
-
公益財団法人東電記念財団「研究助成金」, Apr, 2024 - Mar, 2025
-
公益財団法人関西エネルギー・リサイクル科学研究振興財団（KRF）, Apr, 2024 - Mar, 2025
-
JST-可能性検証, Oct, 2023 - Mar, 2025
-
Apr, 2023 - Mar, 2025
-
基盤C, 文部科学省 JSPS科研費, Apr, 2022 - Mar, 2025
-
公益財団法人 池谷科学技術振興財団, Apr, 2023 - Mar, 2024
-
[萌芽研究] 研究助成, パワーアカデミー, Mar, 2023 - Mar, 2024
-
公益財団法人村田学術振興財団, Jun, 2022 - May, 2023
-
若手研究, 文部科学省, Apr, 2019 - Mar, 2022
-
先端的低炭素化技術開発ALCA, 科学技術振興機構, Oct, 2017 - Mar, 2021
Industrial Property Rights
10
There are no coauthors to display.
{{coauthor.Related.name_str}}
{{coauthor.Related.last_modified}} Updated
Social Activities
2