Froemel Joerg

J-GLOBAL         Last updated: Jul 22, 2019 at 13:52
 
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Name
Froemel Joerg
E-mail
Joerg.froemel.e5tohoku.ac.jp
Affiliation
Tohoku University
Section
WPI-Advanced Institute for Materials Research
Job title
准教授

Research Areas

 
 

Published Papers

 
S. Bargiel, M. Baranski, M. Wiemer, J. Froemel, W.-S. Wang, C. Gorecki
Micromachines   10(3) 185   Mar 2019   [Refereed]
C. Gorecki, J. Lullin, S. Perrin, S. Bargiel, J. Albero, O. Gaiffe, J. Rutkowski, J. M. Cote, J. Krauter, W. Osten, W.-S. Wang, M. Weimer, and J. Froemel
Biomedical Optics Express   10(3) 1111-1125   Feb 2019   [Refereed]
R. Kaneko, J. Froemel, S. Tanaka
Sensors and Actuators A: Physical   284 120-128   Dec 2018   [Refereed]
C. Liu, J. Froemel, J. Chen, T. Tsukamoto, S. Tanaka
Microsystem Technologies   25(2) 487-497   Feb 2019   [Refereed]
© 2018 Springer-Verlag GmbH Germany, part of Springer Nature This paper reports a laterally vibrating MEMS resonant vacuum sensor which senses ambient pressure based on the squeeze-film damping effect. The single-anchored double-ended tuning fork ...
Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames
K. Tanaka, H. Hirano, M. Kumano, J. Froemel, S. Tanaka
Micromachines   9(4) 181   Apr 2018   [Refereed]
T. Takahata, H. Hirano, J. Froemel, S. Tanaka, Y. Takakuwa
IEEJ Transactions on Sensors and Micromachines   138(8) 387-391   2018   [Refereed]
Cu-Cu Low Temperature Bonding with Surface Pre-Treatment Methods
M. Baum, J. Froemel, W.-S. Wang, M. Wiemer, T. Otto
WaferBond   39-40   Nov 2017   [Refereed]
Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly y-cutting
M. S. Al Farisi, H. Hirano, J. Froemel, and S. Tanaka
J. Micromech. Microeng.   27(1) 015029   2017   [Refereed]
C. Liu, H. Hirano, J. Froemel, and S. Tanaka
Sensors and Actuators A: Physical   261 210-218   2017   [Refereed]
K. Tanaka, W.-S. Wang, M. Baum, J. Froemel, H. Hirano, S. Tanaka, M. Wiemer, and T. Otto
Micromachines   7(12) 234   Dec 2016   [Refereed]
M. P. Nguyen, J. Froemel, S. Hatayama, Y. Sutou, J. Koike, S. Tanaka, M. Esashi, T. Gessner, T. Gessner
16th International Conference on Nanotechnology - IEEE NANO 2016   566-568   Nov 2016   [Refereed]
© 2016 IEEE. Lead telluride (PbTe) thin films have been deposited on SiO 2 substrate using thermal evaporation method. The structure of the films was found to have a face-centered cubic (fcc) with predominant grain growth in the (200) direction fo...
C. Liu, H. Hirano, J. Froemel, J. Froemel, S. Tanaka
ECS Transactions   75 291-297   Jan 2016   [Refereed]
© 2016 The Electrochemical Society. A novel wafer-level vacuum thermocompression bonding using electroplated Ag bonding frames which were planarized by diamond fly cutting was described. At relatively low temperature and press pressure, high shear...
Wang Wei-Shan, Wiemer Maik, Froemel Joerg, Enderlein Tom, Gessner Thomas, Lullin Justine, Bargiel Sylwester, Passilly Nicolas, Albero Jorge, Gorecki Christophe
OPTICAL MICRO- AND NANOMETROLOGY VI   9890    2016   [Refereed]
Electroplating of Neodymium Iron Alloys
2016 IEEE 11TH ANNUAL INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS)      2016   [Refereed]
Fabrication of a Multilayer Spiral Coil by Selective Bonding, Debonding and MEMS Technologies
2016 IEEE 11TH ANNUAL INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS (NEMS)      2016   [Refereed]
Bargiel,S.; Baranski,M.; Passilly,N.; Gorecki,C.; Wiemer,M.; Froemel,J.; Wuensch,D.; Wang,W.-S.
SPIE MOEMS and Miniaturized Systems XIV, Proceedings      Feb 2015   [Refereed]
Wang Wei-Shan, Lullin Justine, Froemel Joerg, Wiemer Maik, Bargiel Sylwester, Passilly Nicolas, Gorecki Christophe, Gessner Thomas
MOEMS AND MINIATURIZED SYSTEMS XIV   9375    2015   [Refereed]
M. Baranski, S. Bargiel, N. Passilly, C. Gorecki, C. Jia, J. Froemel, and M. Wiemer
Appl. Opt.   54(22) 6924-6934   2015   [Refereed]
J. Froemel, M. Baum, M. Wiemer, and T. Gessner
J. Microelectromech. Syst.   24(6) 1973-1980   2015   [Refereed]
Froemel,J.; Baum,M.; Wiemer,M.; Gessner,T
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on, (DOI 10.1109/LTB-3D.2014.6886198)   62   Jul 2014   [Refereed]
Multi-wafer Bonding, Stacking and Interconnecting of Integrated 3-D MEMS Micro Scanners
Wiemer,M.; Wuensch,D.; Froemel,J.; Gessner,T.; Bargiel,S.; Baranski,M.; Passily,N.; Gorecki,C.
International Journal of Microwave and Optical Technology   9(1) 128-133   Jan 2014   [Refereed]
M. Baranski, S. Bargiel, N. Passily, B. Guichardaz, E. Herth, C. Gorecki, C. Jia, J. Froemel, and M. Wiemer
Photo. Techn. Lett.   26(1) 101-103   2014   [Refereed]
3D micro-optical lens scanner made by multi-wafer bonding technology
Bargiel,S.; Gorecki,C.; Baranski,M.; Passilly,N.; Wiemer,M.; Jia,C.; Froemel,J.
SPIE MOEMS and Miniaturized Systems XII, (DOI 10.1117/12.2002422)      Feb 2013   [Refereed]
Influence of test speed on the bonding strength of glass frit bonded wafers
Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.
Proceedings of 11th Youth Symposium on experimental solid mechanics   100-101   May 2012   [Refereed]
Mechanical characterization of glass frit bonded wafers
Vogel,K.; Wuensch,D.; Uhlig,S.; Froemel,J.; Naumann,F.; Wiemer,M.; Gessner,T.
Proceedings of 11th Youth Symposium on experimental solid mechanics   239-245   May 2012   [Refereed]
Froemel,J.; Lin,Y.; Wiemer,M.; Gessner,T.; Esashi,M.
Low Temperature Bonding for 3D Integration (LTB-3D), 2012 3rd IEEE International Workshop on, Proceedings   163   May 2012   [Refereed]
Haubold,M.; Lin,Y.; Froemel,J.; Wiemer,M.; Esashi,M.; Gessner,T.
Microsystem Technologies   18(4) 515-521   Apr 2012   [Refereed]
S. Bargiel, C. Jia, M. Baranski, J. Froemel, N. Passilly, C. Gorecki, M. Wiemer
Procedia Engineering   47 1133-1136   2012   [Refereed]
Metal Thermo Compression Bonding at Wafer Level and its Capabilities for 3D Integration
Baum,M.; Roscher,F.; Froemel,J.; Jia,C.; Rank,H.; Hausner,R.; Reichenbach,R.; Wiemer,M.; Gessner,T.
Waferbond 2011 - Conference on Wafer Bonding for Micro Systems, 3D and Wafer Level Integration, Proceedings   83   Dec 2011   [Refereed]
HF-MEMS Schalter mit ohmschen Kontakt und lateraler Bewegungsrichtung
Leidich,S.; Kurth,S.; Nowack,M.; Bertz,A.; Froemel,J.; Kaufmann,C.; Gessner,T.
Mikrosystemtechnik Kongress 2011, Proceedings   976-979   Oct 2011   [Refereed]
Froemel,J.; Baum,M.; Wiemer,M.; Roscher,F.; Haubold,M.; Jia,C.; Gessner,T
16th International IEEE Conference on Solid-State Sensors, Actuators & Microsystems, Proceedings   990-994   Jun 2011   [Refereed]
Challenges of Smart Systems Integration
J. Froemel
FIRST Outreach Program International Symposium on Innovative Nanoelectronics & Systems, Proceedings   63-71   Feb 2011   [Invited]
Lin,Y.-C.; Froemel,J.; Sharma,P.; Inoue,A.; Esashi,M.; Gessner,T.
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on, Proceedings (DOI 10.1109/MEMSYS.2011.5734473)   509-512   Jan 2011   [Refereed]
Kurth Steffen, Leidich Stefan, Bertz Andres, Nowack Markus, Froemel Joerg, Kaufmann Christian, Faust Wolfgang, Gessner Thomas, Akiba Akira, Ikeda Koichi
RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS AND NANODEVICES X   7928    2011   [Refereed]
Akiba,A.; Mitarai,S.; Morita,S.; Ikeda,I.; Kurth,S.; Leidich,S.; Bertz,A.; Nowack,M.; Froemel,J.; Gessner,T
2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST   828-831   2010   [Refereed]
Lin,Y.-C.; Braeuer,J.; Hofmann,L.; Baum,M.; Froemel,J.; Wiemer,M.; Esashi,M.; Gessner,T.
IEEE 3rd International Conference on Nano/Molecular Medicine and Engineering (NANOMED)   313-317   Oct 2009   [Refereed]
Lin,Y.-C.; Baum,M.; Haubold,M.; Froemel,J.; Wiemer,M.; Gessner,T.; Esashi,M.
Transducers 2009, 15th International Conference on Solid-State Sensors and Microsystems, Proceedings   244-247   Jun 2009   [Refereed]
Characterization of eutectic wafer bonding using Gold and Silicon
Lin,Y.-C.; Baum,M.; Haubold,M.; Froemel,J.; Wiemer,M.; Gessner,T.; Esashi,M.
Smart Systems Integration 2009, Proceedings   56-63   Mar 2009   [Refereed]
Wiemer,M.; Froemel,J.; Haubold,M.; Jia,C.; Wuensch,D.; Gessner,T.
Semiconductor Wafer Bonding 10: Science, Technology, and Applications   16(8) 81-92   Oct 2008   [Refereed]
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS   319-+   2008   [Refereed]
Wiemer,M.; Froemel,J.; Bagdahn,J.; Knechtel,R.
Micromaterials and Nanomaterials   264   Sep 2007   [Refereed]
Advanced Packaging of smart systems
Gessner,T.; Wiemer,M.; Froemel,J.; Vogel,M.
10th SEMI Microsystem/MEMS Seminar, Proceedings   45-48   Dec 2006   [Refereed]
Knechtel,R.; Wiemer,M.; Froemel,J.
Microsystem Technologies   12(5) 468-472   2006   [Refereed]
Froemel,J.; Billep,D.; Gessner,T.; Wiemer,M.
Microsystem Technologies   16(8) 481-483   2006   [Refereed]
Packaging of MEMS structures in SCREAM technology using anodic bonding
Froemel,J.; Wiemer,M.; Gessner,T.
Micro System Technologies 2005, Proceedings   99-104   Oct 2005   [Refereed]
Billep,D.; Hiller,K.; Froemel,J.; Tenholte,D.; Reuter,D.; Doetzel,W.; Gessner,T.
SPIE Symposium on Microtechnologies for the New Millennium 2005, (DOI 10.1117/12.608312)   341   May 2005   [Refereed]
Low temperature adhesive bonding by using SU-8 photoresist
Jia,C.; Wiemer,M.; Froemel,J.; Otto,T.; Gessner,T.
The 2nd International Workshop on Wafer Bonding for MEMS Technologies, Proceedings   43-44   Apr 2005   [Refereed]
Okada,H.; Itoh,T.; Froemel,J.; Gessner,T.; Suga,T.
The 13th International Conference on Solid-State Sensors, Actuators and Microsystems; Digest of Technical papers (DOI 10.1109/SENSOR.2005.1496571)   932-935   2005   [Refereed]
Bonding and contacting of MEMS-structures on wafer level
Wiemer,M.; Froemel,J.; Jia,C.; Gessner,T.
The Electrochemical Society - 203 rd meeting, Proceedings   301-308   May 2003   [Refereed]
Debonding of directly wafer-bonded silicon after high temperature process steps
Bagdahn,J.; Knoll,H.; Petzold,M.; Wiemer,M.; Froemel,J
The Electrochemical Society - 203rd meeting, proceedings   1022   2003   [Refereed]

Misc

 
Process Development for Smart Systems Integration in MEMS
Ecke,R.; Froemel,J.; Schulz,S.E.; Wiemer,M.; Gessner,T.
mst news   3 35-36   2009   [Invited]
Herstellung von Nanostrukturen und ihre Anwendung für Fügeverbindungen
Jia,C.; Froemel,J.; Wiemer,M.
Laser Magazin   6    2008   [Invited]
AVT als Basis erfolgreicher MEMS-Kommerzialisierung
Froemel,J.; Wiemer,M.; Gessner,T.
Mikroproduktion   1    2007   [Invited]

Books etc

 
Gallium-based Solid Liquid Interdiffusion Bonding of Semiconductor Subtrates near room temperature
J. Froemel
Universitätsverlag Chemnitz   2015   
Chapter Thermocompression Bonding of Semiconductor Wafers
Froemel,J.; Baum,M.; Wiemer,M. (Part:Joint Work, Book: Smart Systems Integration for Micro- and Nanotechnologies)
Spinger   2014   
Chapter Highly Reliable and Low Voltage Actuated Ohmic RF MEMS Switch with Wafer Level Packaging
Kurth,S.; Nowack,M.; Voigt,S.; Bertz,A.; Froemel,J.; Kaufmann,C.; Gessner,T.; Akiba,A.; Ikeda,K. (Part:Joint Work, In the book: RF MEMS Technologies: Recent Developments)
2013   
Chapter Wafer bonding in micro mechanics and microelectronics - an overview
Wiemer,M.; Froemel,J.; Gessner,T.; Otto,T. (Part:Joint Work, In the book: The World of Electronic Packaging and System Integration)
Spinger   2004   

Conference Activities & Talks

 
3D-Integration and Wafer Bonding for MEMS Packaging [Invited]
J. Froemel
International Conference on Electronics Packaging   19 Apr 2017   
Measuring Thermal Conductivity of One-Dimensional Nanostructures
Nguyen,M.P.; Froemel,J.; Nakayama,K.S.; Yaginuma,S.; Tanaka,S.; Esashi,M. and Gessner,T.
The AIMR International Symposium   16 Feb 2015   
Thermoelectric Properties of Metallic Glass Nanostructures
Nguyen,M.P.; Froemel,J.; Nakayama,K.S.; Yaginuma,S.; Tanaka,S.; Esashi,M. and Gessner,T.
Sendai Micro Nano International Forum   26 Nov 2014   
Solid-Liquid Interdiffusion Bonding of Semiconductor Substrates [Invited]
Froemel,J.; Baum,M.; Wiemer,M.; Tanaka, S.; Esashi, M. and Gessner,T.
Sendai Micro Nano International Forum   26 Nov 2014   
Advanced material research for smart systems [Invited]
Gessner,T.; Froemel,J.; Braeuer,J.; Gabler,F.; Wiemer,M.; Hermann,S.; Lin,Y.-C.; Tsai,Y.-C.; Esashi,M.
AIMR International Symposium   17 Feb 2014   
Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature. Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration [Invited]
Froemel,J.; Wiemer,M.; Tanaka,S.; Esashi,M.; Gessner,T.
Conference on Wafer Bonding for Microsystems 3D- and Wafer Level Integration   5 Dec 2013   
Metal interlayer based semiconductor wafer bonding [Invited]
Metal interlayer based semiconductor wafer bonding
MEMS Engineer Forum 2013   13 Mar 2013   
Robust and high-reliability packages for high pressure sensors by using reactive wafer bonding
Braeuer,J.; Besser,J.; Froemel,J.; Wiemer,M.; Gessner,T
Semicon Japan, STS session 11   5 Dec 2012   
Waferbonding Technologies for Smart Integrated Systems [Invited]
Gessner,T.; Froemel,J.; Wang, W.-S.; Braeuer,J.; Lin,Y.-C.; Esashi,M.
Waferbonding Technologies for Smart Integrated Systems   20 Feb 2012   
Low Temperature Metal Interdiffusion Bonding for Micro Devices
Froemel,J.; Lin,Y.-C.; Gessner,T.; Esashi,M.
World Premier International Research Center AIMR Annual Workshop   20 Feb 2012   
Metallic Glass Thin Films for MEMS Bonding
Lin,Y.-C.; Froemel,J.; Sharma,P.; Inoue,A; Gessner,T.
World Premier International Research Center AIMR Annual Workshop   21 Feb 2011   
Micro/Nanotechnologies towards Smart Systems [Invited]
Gessner,T.; Lin,Y.-C.; Lee,J.-W.; Wang,W.-S.; Froemel,J.
World Premier International Research Center AIMR Annual Workshop   21 Feb 2011   
NEMS/MEMS and passive components integration by using novel LTCC substrate
Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.
Smart Systems Integration 2010   23 Mar 2010   
NEMS/MEMS Integration for future One-chip mobile RF-systems
Froemel,J.; Lin,Y.; Mori,M.; Tanaka,S.; Gessner,T.; Esashi,M.
DFG workshop on nanoelectronics   17 Jan 2010   
Micro Devices for RF Applications
Gessner,T.; Leidich,S.; Nowack,M.; Froemel,J.; Hofmann,L.; Kurth,S.; Bertz,A.
ISMOT 2009   16 Dec 2009   
An Investigation of Cu-Cu Thermal Compression Wafer Bonding
C. Jia, M. Baum, J. Froemel, I. Schubert, M. Wiemer, T. Gessner, A. Schneider, P. Frey, H. Rank, and A. Trautmann
Conference on Wafer Bonding for Microsystems and Conference on Wafer Bonding for Microsystems and Wafer Level Integration   6 Dec 2009   
Fraunhofer ENAS research building introduction [Invited]
J. Froemel
The 5th Fraunhofer-Gesellschaft Symposium   24 Nov 2009   
Thermocompresion bonding with gold interfaces
Froemel,J.; Haubold,M.; Wiemer,M.; Gessner,T.
Smart System Integration 2009   11 Mar 2009   
Characterisation of Gold and Silicon Eutectic for Wafer Bonding Applications
Lin,Y.-C.; Froemel,J.; Esashi,M.; Gessner,T.
World Premier International Research Center AIMR Annual Workshop   1 Mar 2009   
Investigations of Bonding Mechanism with Thin Gold Layers
Froemel,J.; Gessner,T.
World Premier International Research Center AIMR Annual Workshop   1 Mar 2009   
Reproduciple reliable AuSi eutectic wafer bond process with high yield
Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.
IMECE2007   11 Nov 2007   
Fabrication of SOI substrates with buried silicide layers for BICMOS-applications
Froemel,J.; Zimmermann,S.; Wiemer,M.; Gessner,T.
Forum Nano-Hetero System Integration   30 Jul 2007   
Herstellungstechnologie und Testverfahren von Fügeverbindungen der Sensorebenen
Wiemer,M.; Jia,C.; Froemel,J.
ZVEI: Qualifizierungsmethoden für Drucksensor-Anwendungen   24 May 2007   
Development of wafer level packaging for MEMS micro mirrors
Froemel,J.; Sato,Y.; Ohtaka,K; Gessner,T.
Smart System Integration 2007   27 Mar 2007   
Improvement of solid Au-Si eutectic bond process
Schwerdtner,R.; Froemel,J.; Wiemer,M.; Gessner,T.
Conference on Wafer Bonding for MEMS Technologies and Wafer Level Integration 2007   2007   
Advanced packaging is the breakthrough technology of MEMS commercialisation
Froemel,J.; Gessner,T.
The 12th International Nanotech Symposium   8 Nov 2006   
Development of AuSi eutectic wafer bond processes with high yield
Froemel,J.; Schwerdtner,R.; Wiemer,M.; Gessner,T.
2nd WORKSHOP ON WAFER BONDING FOR MEMS TECHNOLOGIE   9 Apr 2006   
MEMS and MOEMS Packaging
Gessner,T.; Froemel,J.; Jung,E.; Reichl,H.
2nd Mechatronics and Microsystems Symposium DCMM   7 Sep 2005   
The improvement of the bonding strength of low temperature anodic bonding
Hata,S.; Froemel,J.; Gessner,T.
Japan Institute of Electronics Packaging: Packaging Workshop   16 Mar 2005   
Trends der Technologieentwicklung im Bereich Waferbonden
6. Chemnitzer Fachtagung Mikromechanik & Mikroelelektronik
29 Oct 2003   
Selektives Niedertemperaturbonden mit SU-8 fuer Wafer-Level-Verkappung von mikromechanischen Strukturen
Reuter,D.; Froemel,J.; Schwenzer,G.; Bertz,A.; Gessner,T.
6. Chemnitzer Fachtagung Mikromechanik & Mikroelektronik   29 Oct 2003   
Bewertung von Niedertemperaturbondverfahren für Drucksensoren in der Automobiltechnik
Wiemer,M.; Froemel,J.; Gessner,T.; Nowak,B.; Suedkamp,W.; Peschka,A.; Bagdahn,J.; Petzold,M.
MicroCar 2003   26 Jun 2003