論文

査読有り
2017年

Relationship between threshold current density of electromigration damage considering void and hillock formation and reservoir shape in interconnect line

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
  • Ryuji Takaya
  • ,
  • Kazuhiko Sasagawa
  • ,
  • Kazuhiro Fujisaki
  • ,
  • Takeshi Moriwaki

記述言語
英語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1115/IPACK2017-74092
出版者・発行元
American Society of Mechanical Engineers

Reservoir structures are often constructed in the interconnection to prevent the electromigration damages. In this study, a numerical simulation technique for analyzing the atomic density distributions in the line under high current density was used to evaluate the effects of reservoir length and location on the threshold current density considering void and hillock generations. The threshold current density is determined when the local atomic density in the line reaches the upper critical value for hillock creation or the lower critical value for void generation. Atomic density distributions in the line were simulated when cathode and anode reservoir lengths were changed. The threshold current density considering void formation became higher with longer cathode reservoir and shorter anode reservoir. However, opposite results obtained in the case of hillock formation. It was found that there was an optimum value of reservoir length, corresponding to both critical values of hillock and void initiation.

リンク情報
DOI
https://doi.org/10.1115/IPACK2017-74092
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000418396400004&DestApp=WOS_CPL
ID情報
  • DOI : 10.1115/IPACK2017-74092
  • ISSN : 2378-8267
  • SCOPUS ID : 85041750951
  • Web of Science ID : WOS:000418396400004

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