Fukue Takashi
(福江 高志)
Modified on: 02/18
Papers
88
Entries per page
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Ichthyological Research, Nov 6, 2023 Peer-reviewed
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Thermal Science and Engineering, 31(4) 31-40, Oct, 2023 Peer-reviewedLast authorCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedLast authorCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedLast authorCorresponding author
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Proceedings of the 17th International Heat Transfer Conference, IHTC-17, Aug, 2023 Peer-reviewedLead authorCorresponding author
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Proceedings of the 17th International Heat Transfer Conference, IHTC-17, Aug, 2023 Peer-reviewedCorresponding author
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KIT Progress, 31 136-146, Mar, 2023 Peer-reviewedLead authorCorresponding author
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Journal of JSEE, 70(4) 4_64-4_70, Jul, 2022 Peer-reviewed
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Frontiers in Heat and Mass Transfer, 18(29) 1-9, May, 2022 Peer-reviewedCorresponding author
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JAPANESE JOURNAL OF MULTIPHASE FLOW, 36(1) 107-114, Mar, 2022 Peer-reviewed
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KIT Progress, 30 127-138, Mar, 2022 Peer-reviewed
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nature Scientific Reports, 12(2362) 1-12, Feb, 2022 Peer-reviewed
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Thermal Science and Engineering, 30(1) 1-12, Jan, 2022 Peer-reviewedCorresponding author
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Proceedings of the 2021 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021, Oct, 2021 Peer-reviewedCorresponding author
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Proceedings of the 2021 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021, Oct, 2021 Peer-reviewedCorresponding author
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Proceedings of the 2021 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021, Oct, 2021 Peer-reviewedLead authorCorresponding author
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Journal of Technology & Innovation, 1(1) 26-29, Feb, 2021 Peer-reviewedCorresponding author
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Proceedings of the 31st International Symposium on Transport Phenomena; ISTP31, Oct 16, 2020 Peer-reviewedCorresponding author