Fukue Takashi
(福江 高志)
Modified on: 02/18
Papers
88
Entries per page
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Ichthyological Research, Nov 6, 2023 Peer-reviewed
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Thermal Science and Engineering, 31(4) 31-40, Oct, 2023 Peer-reviewedLast authorCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedLast authorCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedCorresponding author
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Proceedings of the 33rd International Symposium on Transport Phenomena; ISTP-33, Sep, 2023 Peer-reviewedLast authorCorresponding author
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Proceedings of the 17th International Heat Transfer Conference, IHTC-17, Aug, 2023 Peer-reviewedLead authorCorresponding author
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Proceedings of the 17th International Heat Transfer Conference, IHTC-17, Aug, 2023 Peer-reviewedCorresponding author
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KIT Progress, 31 136-146, Mar, 2023 Peer-reviewedLead authorCorresponding author
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Journal of JSEE, 70(4) 4_64-4_70, Jul, 2022 Peer-reviewed
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Frontiers in Heat and Mass Transfer, 18(29) 1-9, May, 2022 Peer-reviewedCorresponding author
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JAPANESE JOURNAL OF MULTIPHASE FLOW, 36(1) 107-114, Mar, 2022 Peer-reviewed
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KIT Progress, 30 127-138, Mar, 2022 Peer-reviewed
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nature Scientific Reports, 12(2362) 1-12, Feb, 2022 Peer-reviewed
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Thermal Science and Engineering, 30(1) 1-12, Jan, 2022 Peer-reviewedCorresponding author
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Proceedings of the 2021 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021, Oct, 2021 Peer-reviewedCorresponding author
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Proceedings of the 2021 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021, Oct, 2021 Peer-reviewedCorresponding author
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Proceedings of the 2021 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems; InterPACK2021, Oct, 2021 Peer-reviewedLead authorCorresponding author
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Journal of Technology & Innovation, 1(1) 26-29, Feb, 2021 Peer-reviewedCorresponding author
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Proceedings of the 31st International Symposium on Transport Phenomena; ISTP31, Oct 16, 2020 Peer-reviewedCorresponding author
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Proceedings of the 31st International Symposium on Transport Phenomena; ISTP31, (15) 61-66, Oct 15, 2020 Peer-reviewedCorresponding author
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Proceedings of the 31st International Symposium on Transport Phenomena; ISTP31, Oct 15, 2020 Peer-reviewedCorresponding author
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Proceedings of the 31st International Symposium on Transport Phenomena; ISTP31, Oct 15, 2020 Peer-reviewedCorresponding author
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Proceedings of the 31st International Symposium on Transport Phenomena; ISTP31, Oct 14, 2020 Peer-reviewedCorresponding author
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Frontiers in Heat and Mass Transfer, 15(16), Oct, 2020 Peer-reviewedCorresponding author
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Journal of the Open CAE Society of Japan, 2(1) 1-21, Jul, 2020 Peer-reviewedLast authorCorresponding author
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Proceedings of the 15th International Conference on Fluid Control, Measurements and Visualization; FLUCOME2019, May, 2019 Peer-reviewedCorresponding author
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KIT Progress, 27 199-208, Mar, 2019 Peer-reviewed
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KIT Progress, 27 163-172, Mar, 2019 Peer-reviewedLead author
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Proceedings of Printing for Fabrication 2018 (NIP34), Sep, 2018 Peer-reviewedLead author
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Proceedings of the 16th International Heat Transfer Conference, IHTC-16, 2018-August No. 24060-3866, Aug, 2018 Peer-reviewedCorresponding author
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2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, 456-458, Jun 6, 2018 Peer-reviewedCorresponding author
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2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, 475-478, Jun 6, 2018 Peer-reviewedLast author
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International Journal of Engineering Research and Development, 14(3) 22-28, Mar, 2018 Peer-reviewedLast author
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Proceedings of the 11th Pacific Symposium on Flow Visualization and Image Processing; PSFVIP-11, No. 30, Dec, 2017 Peer-reviewedCorresponding author
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Proceedings of the 11th Pacific Symposium on Flow Visualization and Image Processing; PSFVIP-11, No. 29, Dec, 2017 Peer-reviewedLead author
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Proceedings of the 28th International Symposium on Transport Phenomena; ISTP-28, No. 25, Sep, 2017 Peer-reviewedLast author
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Proceedings of the 28th International Symposium on Transport Phenomena; ISTP-28, No. 24, Sep, 2017 Peer-reviewedLast author
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Proceedings of the 28th International Symposium on Transport Phenomena; ISTP-28, No. 20, Sep, 2017 Peer-reviewedLead author
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Journal of Engineering Research and Development, 13(3) 57-68, Mar, 2017 Peer-reviewedLast author
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2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 405-408, 2017 Peer-reviewedCorresponding author
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2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 390-393, 2017 Peer-reviewedLast author
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International Journal of Engineering Research and Development, 12(12) 47-52, Dec, 2016 Peer-reviewed
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Transactions of The Japan Institute of Electronics Packaging, 9(1) E16-014-1-E16-014-9, Dec, 2016 Peer-reviewed
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Proceedings of the 4th International Forum on Heat Transfer; IFHT2016, No. 1980, Nov, 2016 Peer-reviewedLast author
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Proceedings of the 4th International Forum on Heat Transfer; IFHT2016, No. 2008, Nov, 2016 Peer-reviewedCorresponding author
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Proceedings of the 4th International Forum on Heat Transfer; IFHT2016, No. 1868, Nov, 2016 Peer-reviewedLead author
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Proceedings of the 32nd International Conference on Digital Printing Technologies; NIP32, Sep, 2016 Peer-reviewedLead author
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Proceedings of the 27th International Symposium on Transport Phenomena; ISTP-27, Sep, 2016 Peer-reviewed
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Proceedings of the 27th International Symposium on Transport Phenomena; ISTP-27, Sep, 2016 Peer-reviewed