2016年7月
Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films
ENGINEERING FRACTURE MECHANICS
- ,
- ,
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- 巻
- 159
- 号
- 開始ページ
- 98
- 終了ページ
- 114
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.engfracmech.2016.03.031
- 出版者・発行元
- PERGAMON-ELSEVIER SCIENCE LTD
We performed in-situ field emission scanning electron microscopy fracture toughness tests on single-crystalline and polycrystalline submicron-thick Cu films. In all specimens, the notch root became blunt, and a crack was initiated from the blunted notch root. The critical crack tip opening displacement (CTOD) for crack initiation, delta(i), was thickness dependent, where di decreased with a decrease in the thickness. The critical CTOD normalized by the thickness, delta(i)/B, values of the films were similar (delta(i)/B = 1.4-1.9), irrespective of the film thickness and microstructure. This suggested that the local fractures of the submicron Cu films were similar. (C) 2016 Elsevier Ltd. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/j.engfracmech.2016.03.031
- ISSN : 0013-7944
- eISSN : 1873-7315
- Web of Science ID : WOS:000374336500007