論文

査読有り
2016年7月

Effects of film thickness on critical crack tip opening displacement in single-crystalline and polycrystalline submicron Cu films

ENGINEERING FRACTURE MECHANICS
  • Hiroyuki Hirakata
  • ,
  • Takuya Yoshida
  • ,
  • Toshiyuki Kondo
  • ,
  • Kohji Minoshima

159
開始ページ
98
終了ページ
114
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/j.engfracmech.2016.03.031
出版者・発行元
PERGAMON-ELSEVIER SCIENCE LTD

We performed in-situ field emission scanning electron microscopy fracture toughness tests on single-crystalline and polycrystalline submicron-thick Cu films. In all specimens, the notch root became blunt, and a crack was initiated from the blunted notch root. The critical crack tip opening displacement (CTOD) for crack initiation, delta(i), was thickness dependent, where di decreased with a decrease in the thickness. The critical CTOD normalized by the thickness, delta(i)/B, values of the films were similar (delta(i)/B = 1.4-1.9), irrespective of the film thickness and microstructure. This suggested that the local fractures of the submicron Cu films were similar. (C) 2016 Elsevier Ltd. All rights reserved.

リンク情報
DOI
https://doi.org/10.1016/j.engfracmech.2016.03.031
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000374336500007&DestApp=WOS_CPL
ID情報
  • DOI : 10.1016/j.engfracmech.2016.03.031
  • ISSN : 0013-7944
  • eISSN : 1873-7315
  • Web of Science ID : WOS:000374336500007

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