2017年11月15日
Development of a Workpiece Evaluation Support Mechanism for Students
Proceedings - 2017 6th IIAI International Congress on Advanced Applied Informatics, IIAI-AAI 2017
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- 開始ページ
- 741
- 終了ページ
- 746
- 記述言語
- 英語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- DOI
- 10.1109/IIAI-AAI.2017.74
- 出版者・発行元
- Institute of Electrical and Electronics Engineers Inc.
In the technology education of Japanese junior high schools there is a manufacturing activity where the students make something, like a bookshelf. The activity encompasses a variety of skills, for example, sawing and planing. It is difficult for the students to evaluate skills objectively by themselves in the manufacturing activities. This paper proposes a mechanism to support students with objectively evaluating skills of their own. The mechanism creates objective evaluations about the angle and the surface roughness of a workpiece by using the sensors of a mobile device. We proposed a mechanism Workpiece Evaluation Support Mechanism for Students, and confirmed that the mechanism is simple in terms of the displayed information and the number of steps.
- ID情報
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- DOI : 10.1109/IIAI-AAI.2017.74
- SCOPUS ID : 85040618406