Eiji Higurashi

Profile Information

Affiliation: Professor, Department of Electronic Engineering, Graduate School of Engineering, Tohoku University

Degree: Ph. D.(Oct, 1999, Tohoku University)

Contact information: higurashitohoku.ac.jp
Researcher number: 60372405
ORCID ID: https://orcid.org/0000-0002-7154-4203
J-GLOBAL ID: 200901009227864538
Researcher ID: KHD-7107-2024
researchmap Member ID: 5000099131

External link: https://www.ecei.tohoku.ac.jp/higurashilab/index-e.html

Research Interests

Research Areas

Research History

Apr, 2024 - Present

Joining and Welding Research Institute, Osaka University
May, 2022 - Present

Visiting Researcher, National Institute of Advanced Industrial Science and Technology (AIST)
Apr, 2022 - Present

Professor, Graduate School of Engineering Department of Electronic Engineering, Tohoku University
Apr, 2020 - Mar, 2022

Leader, Group, Integrated MEMS Research Group, Device Technology Research Institute, National Institute of Advanced Industrial Science and Technology (AIST)
Apr, 2019 - Mar, 2020

Leader, Team, Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST)
Apr, 2017 - Mar, 2019

Associate Professor, Department of Precision Engineering, School of Engineering, The University of Tokyo
Apr, 2017 - Mar, 2019

Leader, Team, Research Center for Ubiquitous MEMS and Micro Engineering, National Institute of Advanced Industrial Science and Technology (AIST)
Apr, 2014 - Mar, 2017

Associate Professor, Department of Precision Engineering, School of Engineering, The University of Tokyo
Apr, 2007 - Mar, 2014

Associate Professor, The Research Center for Advanced Science and Technology, The University of Tokyo
Apr, 2004 - Mar, 2007

Associate Professor, The Research Center for Advanced Science and Technology, The University of Tokyo
Oct, 2003 - Mar, 2004

Associate Professor, Department of Precision Engineering, School of Engineering, The University of Tokyo
Mar, 2002 - Sep, 2003

Senior Research Engineer, Nippon Telegraph and Telephone Corporation (NTT)
Feb, 1996 - Feb, 2002

Research Engineer, Nippon Telegraph and Telephone Corporation (NTT)
Apr, 1991 - Jan, 1996

Nippon Telegraph and Telephone Corporation (NTT)

Committee Memberships

160

Jan, 2024 - Present

Members-at-Large, IEEE Electronics Packaging Society Board of Governors
Jan, 2024 - Present

委員長, 電気学会第41回「センサ・マイクロマシンと応用システム」シンポジウム実行委員会
Dec, 2023 - Present

General Chair, IEEE CPMT Symposium Japan (ICSJ)
May, 2023 - Present

Director, The Japan Institute of Electronics packaging (JIEP)
May, 2023 - Present

委員, エレクトロニクス実装学会北海道・東北支部
May, 2023 - Present

Editor-in-Chief, Editorial Committee of the Transactions of The Japan Institute of Electronics Packaging
Jan, 2023 - Present

Advisor, IEEE EPS Japan Chapter
Jun, 2022 - Present

Vice Chairperson, R&D Steering Committee in The Institute of Electrical Engineers of Japan
Jun, 2022 - Present

Officer, R&D Management, The Sensors and Micromachines Society in The Institute of Electrical Engineers of Japan
Jul, 2021 - Present

Technical Program Committee Member, International Conference on Electronics Packaging (ICEP)
Apr, 2021 - Present

委員, エレクトロニクス実装学会マイクロメカトロニクス実装技術委員会
Jun, 2020 - Present

幹事, 電子実装工学研究所接合界面創成技術委員会
Mar, 2020 - Present

Editorial Board Member, Micromachines
Jun, 2019 - Present

Editor, Editorial Committee of Journal of The Japan Institute of Electronics Packaging
Apr, 2019 - Present

論文委員, エレクトロニクス実装学会マイクロエレクトロニクスシンポジウム（ＭＥＳ）論文委員会
Aug, 2018 - Present

Executive Committee Member, MEMS Engineer Forum
Apr, 2018 - Present

委員, 日本オプトメカトロニクス協会オプトメカトロニクス技術委員会
2018 - Present

Member of International Advisory Committee Board, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
Jun, 2017 - Present

Technical Committee on System NanoTechnology, Institute of Electronics, Information and Communication Engineers
2017 - Present

Organizer, Taiwan-Japan Workshop on Electronic Interconnection

Awards

Nov, 2022

最優秀技術論文賞, SOIウェハのハイブリッド接合を用いた画素並列3層積層CMOSイメージセンサ, 電気学会センサ・マイクロマシン部門主催第39回「センサ・マイクロマシンと応用システム」シンポジウム

後藤正英, 本田悠葵, 難波正和, 井口義則, 更屋拓哉, 小林正治, 日暮栄治, 年吉洋, 平本俊郎
Sep, 2022

ベストペーパー賞, エレクトロニクス実装学会第31回マイクロエレクトロニクスシンポジウム(MES 2021)

穂苅遼平, レハクホウンツー, 武井亮平, 日暮栄治
Jan, 2022

Arnaud Darmont Award for Best Paper, Imaging Sensors and Systems 2022

Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, and Toshiro Hiramoto
Jun, 2020

JIEP Poster Award, 2019 International Conference on Electronics Packaging (ICEP)

Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Toshihiro Miyake, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi
Mar, 2020

優秀論文賞, 応用物理学会集積化MEMS技術研究会主催第11回集積化MEMSシンポジウム

日暮栄治, 東颯人, 山本道貴, 松前貴司, 倉島優一, 高木秀樹, 須賀唯知
Mar, 2020

優秀賞, エレクトロニクス実装学会第33回春季講演大会

多喜川良, 日暮栄治, 浅野種正
May, 2019

Best Poster Presentation Award, 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Yuki Honda, Masahide Goto, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, and Toshiro Hiramoto
Mar, 2019

ポスターアワード, エレクトロニクス実装学会第32回春季講演大会

東颯人, 日暮栄治, 須賀唯知
Mar, 2019

優秀論文賞, 応用物理学会集積化MEMS技術研究会主催第10回集積化MEMSシンポジウム

本田悠葵, 後藤正英, 渡部俊久, 難波正和, 井口義則, 更屋拓哉, 小林正治, 日暮栄治, 年吉洋, 平本俊郎
Mar, 2019

優秀ポスター賞, 応用物理学会集積化MEMS技術研究会主催第9回集積化MEMS技術研究ワークショップ

Yuki Honda, Masahide Goto, Toshihisa Watabe, Kei Hagiwara, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, and Toshiro Hiramoto
Jun, 2018

2018アカデミックプラザ賞, エレクトロニクス実装学会2018アカデミックプラザ賞

日暮栄治, 山本道貴, 須賀唯知
Dec, 2017

シニア会員, 一般社団法人電子情報通信学会

日暮栄治
Apr, 2017

Senior Member, IEEE

日暮栄治
Apr, 2017

Outstanding Technical Paper Award, 2016 International Conference on Electronics Packaging (ICEP)

Masahide Goto, Kei Hagiwara, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, and Toshiro Hiramoto
Mar, 2017

ポスターアワード, エレクトロニクス実装学会第30回春季講演大会

國宗豊, 日暮栄治, 須賀唯知
Jun, 2016

2016アカデミックプラザ賞, エレクトロニクス実装学会

中島文弥, 森田伸友, 日暮栄治, 野上大史, 澤田廉士
Mar, 2016

優秀論文賞, 応用物理学会集積化MEMS技術研究会主催第7回集積化MEMSシンポジウム

後藤正英, 萩原啓, 井口義則, 大竹浩, 更屋拓哉, 小林正治, 日暮栄治, 年吉洋, 平本俊郎
Oct, 2015

最優秀技術論文賞, 電気学会センサ・マイクロマシン部門主催第32回「センサ・マイクロマシンと応用システム」シンポジウム

日暮栄治, 加藤直之, 川合紘夢, 須賀唯知, 岡田咲枝, 萩原泰三
Sep, 2015

ベストペーパー賞, エレクトロニクス実装学会第24回マイクロエレクトロニクスシンポジウム(MES 2014)

日暮栄治, 川合紘夢, 須賀唯知, 岡田咲枝, 萩原泰三
Jun, 2015

Outstanding Paper Award, 18th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2015)

N. Morita, T. Akiyama, H. Nogami, Y. Hayashida, E. Higurashi, T. Ito, R. Sawada

Papers

278

Room temperature wafer bonding through conversion of polysilazane into SiO <inf>2</inf>

Kai Takeuchi, Tadatomo Suga, Eiji Higurashi

Scientific Reports, 14(1), Dec, 2024
Suppression of Surface Roughening of Ag Films by Capping Layer for Ag/Ag Surface Activated Bonding

Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, Eiji Higurashi

2023 IEEE CPMT Symposium Japan (ICSJ), Nov 15, 2023
Template Stripping of Au from Polyimide Film for Smoothing of Bonding Surface

Shogo Koseki, Mika Ogino, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Tomoaki Tokuhisa, Toshikazu Shimizu, Eiji Higurashi

2023 IEEE CPMT Symposium Japan (ICSJ), Nov 15, 2023
Conversion of Perhydropolysilazane into SiO₂ using Plasma Treatment for Wafer Bonding

Kai Takeuchi, Daiki Nemoto, Tadatomo Suga, Eiji Higurashi

2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Oct 25, 2023
Pixel-Parallel Three-Layer Stacked CMOS Image Sensors Using Double-Sided Hybrid Bonding of SOI Wafers

Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto

IEEE Transactions on Electron Devices, 70(9) 4705-4711, Sep 1, 2023
Room temperature bonding of Au assisted by self-assembled monolayer

Kai Takeuchi, Junsha Wang, Beomjoon Kim, Tadatomo Suga, Eiji Higurashi

Applied Physics Letters, 122(5) 051603-051603, Jan 30, 2023
Protection of Activated Au Surface using Self-assembled Monolayer for Room Temperature Bonding

Kai Takeuchi, Junsha Wang, Tadatomo Suga, Beomjoon Kim, Eiji Higurashi

2023 International Conference on Electronics Packaging, ICEP 2023, 173-174, 2023
Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

Shingo Kariya, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi

Microsystems & Nanoengineering, 8(1) 2-2, Dec, 2022
Removal of Adsorbed Water on Si Wafers for Surface Activated Bonding

Kai Takeuchi, Eiji Higurashi, Junsha Wang, Akira Yamauchi, Tadatomo Suga

2022 IEEE CPMT Symposium Japan (ICSJ), 61-64, Nov 9, 2022
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging

Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase, Hideki Takagi

Sensors, 22(21), Nov, 2022
An Ultra-Compact MEMS Pirani Sensor for In-Situ Pressure Distribution Monitoring

Lan Zhang, Jian Lu, Hideki Takagi, Sohei Matsumoto, Eiji Higurashi

Micromachines, 13(10), Oct, 2022
Room temperature bonding of GaN and diamond substrates via atomic layer

Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Yusuke Shirayanagi, Shuichi Hiza, Kunihiko Nishimura, Eiji Higurashi

Scripta Materialia, 215 114725-114725, Jul 1, 2022
Hydrophilic direct bonding of GaN and Si substrates by wet treatments using H<inf>2</inf>SO<inf>4</inf>/H<inf>2</inf>O<inf>2</inf>mixture and NH<inf>3</inf>/H<inf>2</inf>O<inf>2</inf>mixture

Shoya Fukumoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi

Japanese Journal of Applied Physics, 61(SF), Jun 1, 2022
Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer

Shingo Kariya, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi

Japanese Journal of Applied Physics, 61(5), May, 2022
3-Layer Stacking Technology with Pixel-Wise Interconnections for Image Sensors Using Hybrid Bonding of Silicon-on-Insulator Wafers Mediated by Thin Si Layers

Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Eiji Higurashi, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Toshiro Hiramoto

Proceedings - Electronic Components and Technology Conference, 2022-May 122-125, 2022
Efficient heat dissipation from ß-Ga<inf>2</inf>O<inf>3</inf>film directly bonded on diamond substrate

T. Matsumae, Y. Kurashima, H. Takagi, H. Umezawa, H. Watanabe, T. Ito, E. Higurashi

2022 International Conference on Electronics Packaging, ICEP 2022, 99-100, 2022
Low-temperature direct bonding of InP and diamond substrates under atmospheric conditions

Takashi Matsumae, Ryo Takigawa, Yuichi Kurashima, Hideki Takagi, Eiji Higurashi

Scientific Reports, 11(1) 11109-11109, Dec, 2021
Direct bonding of polycrystalline diamond substrate onto Si wafer under atmospheric conditions

T. Matsumae, Y. Kurashima, H. Takagi, H. Umezawa, E. Higurashi

2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, 14, Oct 5, 2021
Hydrophilic bonding of SiC substrate dipped in hydrofluoric acid with Ga<inf>2</inf>O<inf>3</inf> film through atomically thin intermediate layer

T. Matsumae, Y. Kurashima, H. Takagi, H. Umezawa, E. Higurashi

2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, 20, Oct 5, 2021
Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration

Le Hac Huong Thu, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Eiji Higurashi

2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, 6, Oct 5, 2021

Misc.

348

高熱伝導率材料の異種材料集積—Heterogeneous integration of high thermal conductive materials—特集ヘテロジニアス集積技術と光デバイス応用

日暮栄治

Optronics : 光技術コーディネートジャーナル, 42(11) 122-127, Nov, 2023
Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices

Higurashi Eiji

Journal of The Japan Institute of Electronics Packaging, 26(5) 427-433, Aug 1, 2023
研究室だより：東北大学工学研究科電子工学専攻日暮研究室

日暮栄治

電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）, 143(7) NL7_2-NL7_2, Jul 1, 2023
2nd quantized state oscillation in a gain switched 925nm-band QW-LD and its suppression

古戸颯真, CUI Yuwen, 竹内魁, 山田博仁, 横山弘之, 日暮栄治

応用物理学会秋季学術講演会講演予稿集(CD-ROM), 84th, 2023
Heterogeneous integration of high thermal conductive materials

日暮栄治

Optronics, (503), 2023
Progress and future perspective of room-temperature bonding technologies for heterogeneous integration

日暮栄治, 竹内魁

電子情報通信学会技術研究報告(Web), 123(142(CPM2023 10-22)), 2023
Second-quantized-state laser oscillation dynamics of a 925nm-band QW-LD under strong pulsed excitation

CUI Y., 安食聡一郎, 竹内魁, 竹内魁, 日暮栄治, 日暮栄治, 山田博仁, 山田博仁, 山田博仁, 横山弘之 …

応用物理学会春季学術講演会講演予稿集(CD-ROM), 70th, 2023
Heterogeneous Integration and Its Application to Sensors and Microsystems

日暮栄治

Symposium on Microjoining and Assembly Technology in Electronics, 29th, 2023
SOIウェハのハイブリッド接合を用いた画素並列3層積層CMOSイメージセンサ—Pixel-Parallel 3-Layer Stacked CMOS Image Sensors Using Hybrid Bonding of SOI Wafers

後藤正英, 本田悠葵, 難波正和, 井口義則, 更屋拓哉, 小林正治, 日暮栄治, 年吉洋, 平本俊郎

「センサ・マイクロマシンと応用システム」シンポジウム論文集電気学会センサ・マイクロマシン部門 [編], 39 5p, Nov, 2022
SOIウェハのハイブリッド接合を用いた3層積層画素並列CMOSイメージセンサ—3-Layer Stacked Pixel-Parallel CMOS Image Sensors Using Hybrid Bonding of SOI Wafers—情報センシング

後藤正英, 本田悠葵, 難波正和, 井口義則, 更屋拓哉, 小林正治, 日暮栄治, 年吉洋, 平本俊郎

映像情報メディア学会技術報告 = ITE technical report, 46(14) 5-8, Mar, 2022
For efficient heat dissipation from ultra-widegap Ga₂O₃ substrate by direct bonding with diamond substrate

松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 渡邊幸志, 伊藤利充, 日暮栄治

エレクトロニクス実装学会講演大会講演論文集(CD-ROM), 36th, 2022
Room-temperature bonding of GaN/diamond through atomically thin intermediate layer

松前貴司, 倉島優一, 高木秀樹, 白柳裕介, 檜座秀一, 西村邦彦, 日暮栄治

エレクトロニクス実装学会講演大会講演論文集(CD-ROM), 36th, 2022
Direct bonding formation between semiconductor device and diamond substrate via reaction of surface functional groups

松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 日暮栄治

電子情報通信学会大会講演論文集(CD-ROM), 2022, 2022
3-Layer Stacked Pixel-Parallel CMOS Image Sensors Using Hybrid Bonding of SOI Wafers

後藤正英, 本田悠葵, 難波正和, 井口義則, 更屋拓哉, 小林正治, 日暮栄治, 年吉洋, 平本俊郎

映像情報メディア学会技術報告, 46(14(IST2022 10-22)) 1-4, 2022
Welcome to ICEP 2021

Eiji Higurashi

2021 International Conference on Electronics Packaging, ICEP 2021, May 12, 2021
Fabrication and isotropic evaluation of diffraction gratings for miniaturization of atomic clocks

穂苅遼平, LE Thu Hac Huong, 武井亮平, 日暮栄治

マイクロエレクトロニクスシンポジウム論文集, 31st 285-287, 2021
Low Temperature Bonding of Si and Sapphire for a Gas Cell of Miniature Atomic Clock

倉島優一, 柳町真也, 松前貴司, 前田敦彦, 高木秀樹, 日暮栄治

マイクロエレクトロニクスシンポジウム論文集, 31st 22C3-1, 2021
Fabrication of sensors and MEMS by room-temperature bonding using gold thin films

日暮栄治, 松前貴司, 倉島優一, 高木秀樹

応用物理, 90(10) 623-627, 2021
Low-temperature Direct Bonding Of Diamond/Metal Under Atmospheric Conditions

松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 日暮栄治

Symposium on Microjoining and Assembly Technology in Electronics, 27th, 2021
Development of high-T_c superconducting THz emitters using wafer bonding techniques

柏木隆成, KIM Jeonghyuk, 中川駿吾, 中山繭, 山口啄弥, 松前貴司, 倉島優一, 日暮栄治, 高木秀樹, 森龍也 …

応用物理学会春季学術講演会講演予稿集(CD-ROM), 68th 1804-1804, 2021

Books and Other Publications

異種材料の接着・接合技術とマルチマテリアル化

技術情報協会 (Role: Contributor, 第10章, 第4節, 高出力半導体デバイスにおける高放熱構造を実現する常温接合技術)

技術情報協会, Oct, 2017 (ISBN: 9784861046827)
精密加工と微細構造の形成技術

田崎, 裕人 (Role: Contributor, 第7章, 第4節, 表面活性化接合によるプロセス温度の低温化と高機能センサへの応用)

技術情報協会, 2013 (ISBN: 9784861044830)
異種機能デバイス集積化技術の基礎と応用 : MEMS,NEMS,センサ,CMOSLSIの融合

益, 一哉, 年吉, 洋, 町田, 克之 (Role: Contributor, 第8編実装技術編, 第27章 MEMS実装技術)

シーエムシー出版, Nov, 2012 (ISBN: 9784781305868)
fundamentals and applications of MEMS/NEMS engineering

(Role: Contributor)

2009 (ISBN: 9784924728592)
常温接合によるウエハスケールMEMSパッケージ

須賀, 唯知, 日暮, 栄治, Howlader, Matiar R.

須賀唯知, 2008
窒化ガリウムの表面活性化接合とその光デバイスへの応用

日暮, 栄治, 赤池, 正剛

日暮栄治, 2008
MEMSマテリアルの最新技術

江刺, 正喜 (Role: Contributor, 第2章9 微小組立)

シーエムシー出版, Nov, 2007 (ISBN: 9784882319689)
3D-SiP technologies and materials

(Role: Contributor)

2007 (ISBN: 9784882316626)
ナノオプティクス・ナノフォトニクスのすべて : ナノ光技術の基礎から実用まで

梅田, 倫弘, 川田, 善正, 羽根, 一博, 河田, 聡 (Role: Contributor, 第4章 6 光マイクロセンサ)

フロンティア出版, 2006 (ISBN: 4902410079)
MEMS/NEMSの最先端技術と応用展開

前田, 龍太郎, 澤田, 廉士, 青柳, 桂一 (Role: Contributor, 第4章 7 光マニピュレーション)

フロンティア出版, 2006 (ISBN: 4902410087)
MEMS/NEMSの最先端技術と応用展開

前田, 龍太郎, 澤田, 廉士, 青柳, 桂一 (Role: Contributor, 第4章6 光応用バイオセンサ, MEMS/NEMSの最先端技術と応用展開)

フロンティア出版, 2006 (ISBN: 4902410087)
MEMS/NEMSの最先端技術と応用展開

前田, 龍太郎, 澤田, 廉士, 青柳, 桂一 (Role: Contributor, 第4章4 光応用マイクロセンサ, MEMS/NEMSの最先端技術と応用展開)

フロンティア出版, 2006 (ISBN: 4902410087)
ナノフォトニクスへの挑戦

大津元一監修 (Role: Contributor, 第5章マイクロマシンの限界への挑戦)

米田出版,産業図書 (発売), 2003 (ISBN: 4946553177)
光マイクロマシン

澤田, 廉士, 羽根, 一博, 日暮, 栄治 (Role: Joint author)

オーム社, Nov, 2002 (ISBN: 4274035891)
新編光学材料ハンドブック

福見, 俊夫 (Role: Contributor, 8.4.3 マイクロ光アクチュエータ)

リアライズ社, Dec, 2000 (ISBN: 4898080286)
Sensors update

Baltes, H. (Henry), Göpel, W., Hesse, J., Korvink, J. G., Fedder, G. K. (Role: Contributor, Part2 15 Laser-based Microsensors, Sensors Update Volume 6)

VCH, 1999 (ISBN: 3527293299)
Laser in der Medizin : Vorträge des 10. internationalen Kongresses, Laser 91 = Laser in medicine : proceedings of the 10th International Congress, Laser 91

Waidelich, W. (Wilhelm), Waidelich, R. (Raphaela), Hofstetter, A. (Alfons) (Role: Contributor, Laser Stimulation of Biological Cell Fusion with Ultraviolet Low Energy Beam)

Springer, 1992 (ISBN: 354054934X)

Teaching Experience

Apr, 2024 - Aug, 2024

Digital Signal Processing (Tohoku University)
Oct, 2023 - Feb, 2024

Circuits I (Tohoku University)
Aug, 2023 - Aug, 2023

Microscopic Processing of Surfaces (Tohoku University)
Aug, 2023 - Aug, 2023

Advanced Topics on Microscopic Processing of Surfaces (Tohoku University)
Apr, 2023 - Aug, 2023

Digital Signal Processing (Tohoku University)
Oct, 2022 - Feb, 2023

Circuits I (Tohoku University)
Apr, 2022 - Aug, 2022

Digital Signal Processing (Tohoku University)
Oct, 2017 - Feb, 2018

Nano/Micro Mechanical Systems (The University of Tokyo)
Oct, 2016 - Feb, 2017

Seminar (The University of Tokyo)
Sep, 2016 - Dec, 2016

Fundamental Exercise on Precision Engineering (The University of Tokyo)
Sep, 2016 - Dec, 2016

Materials Engineering II (The University of Tokyo)
Apr, 2016 - Aug, 2016

Microsystems for optical applications (The University of Tokyo)
Apr, 2016 - Jul, 2016

Electronic Circuit Engineering II (The University of Tokyo)
Apr, 2016 - Jul, 2016

Mechatronics II (The University of Tokyo)
Oct, 2015 - Feb, 2016

Nano/Micro Mechanical Systems (The University of Tokyo)
Oct, 2015 - Feb, 2016

Seminar (The University of Tokyo)
Sep, 2015 - Dec, 2015

Materials Engineering II (The University of Tokyo)
Apr, 2015 - Aug, 2015

Information (The University of Tokyo)
Apr, 2015 - Jul, 2015

Electronic Circuit Engineering II (The University of Tokyo)
Oct, 2014 - Feb, 2015

Seminar (The University of Tokyo)

Professional Memberships

Oct, 2010 - Present

IEEE
Sep, 2006 - Present

The Institute of Electronics, Information and Communication Engineers (IEICE)
Jul, 2004 - Present

The Japan Institute of Electronics Packaging (JIEP)
Jun, 1999 - Present

The Japan Society for Precision Engineering (JSPE)
Jun, 1996 - Present

The Institute of Electrical Engineers of Japan (IEEJ)
Aug, 1990 - Present

The Japan Society of Applied Physics (JSAP)

Research Projects

ナノ界面制御による常温接合基盤技術の創出

科学研究費助成事業, 基盤研究(B), 日本学術振興会, Apr, 2023 - Mar, 2026

日暮栄治, 竹内魁
接合界面付加加工による革新的異種材料低温集積技術の開発

産学が連携した研究開発成果の展開研究成果展開事業研究成果最適展開支援プログラム(A-STEP) トライアウトトライアウト, 科学技術振興機構, 2020 - 2021

日暮栄治
Controlling the indium oxide surface by hydrogen radical treatment and its applications

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (C), Japan Society for the Promotion of Science, Apr, 2016 - Mar, 2019

Higurashi Eiji
Room-temperature bonding of compound semiconductors and its application to high heat dissipation structure

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (B), Japan Society for the Promotion of Science, Apr, 2013 - Mar, 2016

Higurashi Eiji
New Method for Room Temperature Bonding at Ambient Gas

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (A), Japan Society for the Promotion of Science, Apr, 2011 - Mar, 2014

SUGA Tadatomo, SHIMATSU Takehito, HIGURASHI Eiji
Far-lnfrared BIB Detector Fabrication by Wafer-Bonding Technique

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (B), Japan Society for the Promotion of Science, 2010 - 2012

DOI Yasuo, HIGURASHI Eiji, HOSAKO Iwao
Sensing system using optical micromachine

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (C), Japan Society for the Promotion of Science, 2008 - 2010

IWAOKA Hideto, HIGURASHI Eiji
AuSn bumping process using hydrogen plasma

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (C), Japan Society for the Promotion of Science, 2007 - 2008

HIGURASHI Eiji
Surface activated bonding of GaN and its application for optical devices

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (B), Japan Society for the Promotion of Science, 2005 - 2006

HIGURASHI Eiji, AKAIKE Masatake
Wafer-scale MEMS Package by means of room temperature bonding

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (A), Japan Society for the Promotion of Science, 2004 - 2006

SUGA Tadatomo, HIGURASHI Eiji, HOWLADER Matiar R

Industrial Property Rights

特許第7429368号デバイスの製造方法および接合装置、半導体デバイス

日暮栄治, 須賀唯知, 山本道貴, 倉島優一, 松前貴司, 高木秀樹
特開2023-054515 積層構造体、及び積層構造体の製造方法

佐々木公平, 名倉宙志, 松前貴司, 高木秀樹, 日暮栄治, 倉島優一, 三井田高
特開2022-184075 モザイクダイヤモンドウェハと異種半導体との接合体及びその製造方法、並びに、異種半導体との接合体用モザイクダイヤモンドウェハ

山田英明, 茶谷原昭義, 杢野由明, 松前貴司, 倉島優一, 日暮栄治, 高木秀樹, 檜座秀一, 今村謙, 白柳裕介, 吉嗣晃治, 西村邦彦
特開2022-141171 炭化ケイ素を備える複合体とその製造方法

松前貴司, 高木秀樹, 梅沢仁, 倉島優一, 日暮栄治
特開2022-072318 接合構造体、電子装置、接合構造体の製造方法

三宅敏広, 須賀唯知, 日暮栄治
特開2021-136413 封止構造体およびその製造方法

松前貴司, 倉島優一, 日暮栄治, ▲高▼木秀樹
特開2021-086911 デバイスの製造方法および接合装置、半導体デバイス

日暮栄治, 須賀唯知, 山本道貴, 倉島優一, 松前貴司, 高木秀樹
特許第6004343号半導体装置の製造方法

白鳥悠太, 柏尾典秀, 井田実, 日暮栄治
特開2016-117092 接合方法、接合装置及び接合物を含む構造体

山内朗, 須賀唯知, 日暮栄治
特許第6569107号接合方法、接合装置及び接合物を含む構造体

山内朗, 須賀唯知, 日暮栄治
特開2015-056602 半導体装置およびその製造方法

白鳥悠太, 柏尾典秀, 井田実, 日暮栄治
特開2015-015411 ヘテロ接合バイポーラトランジスタおよびその製造方法

井田実, 明吉智幸, 白鳥悠太, 日暮栄治
特許第5946136号ヘテロ接合バイポーラトランジスタおよびその製造方法

井田実, 明吉智幸, 白鳥悠太, 日暮栄治
特開2014-022699 パッケージおよびその製造方法

白鳥悠太, 柏尾典秀, 井田実, 明吉智幸, 日暮栄治
特開2013-045925 半導体装置およびその製造方法

重川直輝, 井田実, 明吉智幸, 日暮栄治
特許第6004343号半導体装置およびその製造方法

重川直輝, 井田実, 明吉智幸, 日暮栄治
特開2009-148626 血圧計

上西祐司, 日暮栄治, 長沼和則, 須藤昭一, 嶋田純一, 相原公久, 小泉弘, 多々良尚愛, 林田尚一, 美野真司, 小口泰介, 杤久保修
特許第4425984号血圧計

上西祐司, 日暮栄治, 長沼和則, 須藤昭一, 嶋田純一, 相原公久, 小泉弘, 多々良尚愛, 林田尚一, 美野真司, 小口泰介, 杤久保修
特開2009-090132 血圧測定装置

上西祐司, 日暮栄治, 長沼和則, 須藤昭一, 杤久保修
特許第4394734号血圧測定装置

上西祐司, 日暮栄治, 長沼和則, 須藤昭一, 杤久保修

Profile Information

Research Interests

Research Areas

Research History

Committee Memberships

Awards

Papers

Misc.

Books and Other Publications

Teaching Experience

Professional Memberships

Research Projects

Industrial Property Rights

Menu

Coauthors