2009年4月
Gas flow sputtering: Versatile process for the growth of nanopillars, nanoparticles, and epitaxial thin films
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS
- ,
- 巻
- 321
- 号
- 7
- 開始ページ
- 872
- 終了ページ
- 875
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.jmmm.2008.11.053
- 出版者・発行元
- ELSEVIER SCIENCE BV
Gas flow sputtering is a sputter-deposition method that enables soft and high-rate deposition even for oxides or nitrides. It involves sputtering at a high pressure of around 100 Pa and hollow cathode discharge in a tubular or parallel plate target with forced Ar flow. Depending on the sputtering conditions, various structures of magnetic materials are obtained, and some examples are shown in this paper. Co-Pt and Fe nanopillars are fabricated using a tubular target with a large inner diameter (6-40 mm). Fe nanoparticles with diameters ranging from a few nanometers to 150 nm are fabricated using a tubular target with a small inner diameter (5 mm). Magnetite epitaxial thin films are fabricated on MgO and GaAs substrates by substrate heating. (C) 2008 Elsevier B.V. All rights reserved.
- リンク情報
- ID情報
-
- DOI : 10.1016/j.jmmm.2008.11.053
- ISSN : 0304-8853
- CiNii Articles ID : 80020320894
- Web of Science ID : WOS:000263792400061