論文

査読有り 筆頭著者
2014年6月

Low temperature-dependence of N,N-dimethyl-3-methylbenzamide (DEET) release from a functional paper containing paraffin-DEET composites prepared using interfacial polymerization

CHEMICAL ENGINEERING JOURNAL
  • Hideaki Ichiura
  • ,
  • Ken-ichi Yamamoto
  • ,
  • Yoshito Ohtani

245
開始ページ
17
終了ページ
23
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/j.cej.2014.02.019
出版者・発行元
ELSEVIER SCIENCE SA

An interfacial polymerization reaction was used to prepare a functional paper with a polyamide film containing paraffin-N,N-dimethyl-3-methylbenzamide (DEET) composites, which gave a sustained release of DEET with a low temperature dependence. Preparing the polyamide film using an interfacial polymerization reaction eliminated the need for preparing microcapsules and coating the paper with a binder, which is the typical functional paper preparation method. Filter paper impregnated with an oil-water emulsion (composed of ethylenediamine and paraffin microcapsules prepared using methyl methacrylate polymer) was left in a beaker containing a cyclohexane solution of terephthaloyl chloride. The polyamide film containing paraffin-DEET composites could attach itself to the treated paper surface. We studied the release of DEET from the paper with and without paraffin, and its temperature dependence. The functional paper with paraffin showed the sustained release of DEET at high temperatures, but the release was usually inefficient. However, the sustained release of DEET was not temperature dependent, and this was found to be caused by the release of DEET being controlled by the paraffin melting. The optimum paraffin/DEET ratio was 9:1, taking into consideration the amount of DEET released from the paper and the low temperature dependence of the sustained release of DEET. (C) 2014 Elsevier B.V. All rights reserved.

リンク情報
DOI
https://doi.org/10.1016/j.cej.2014.02.019
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000335275200003&DestApp=WOS_CPL
URL
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84896835632&origin=inward
ID情報
  • DOI : 10.1016/j.cej.2014.02.019
  • ISSN : 1385-8947
  • eISSN : 1873-3212
  • SCOPUS ID : 84896835632
  • Web of Science ID : WOS:000335275200003

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