論文

査読有り 本文へのリンクあり
2021年11月

Effect of punch surface grooves on microformability of AA6063 backward microextrusion

Micromachines
  • Tatsuya Funazuka
  • ,
  • Kuniaki Dohda
  • ,
  • Tomomi Shiratori
  • ,
  • Ryo Hiramiya
  • ,
  • Ikumu Watanabe

12
11
開始ページ
1299
終了ページ
1299
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.3390/mi12111299
出版者・発行元
{MDPI} {AG}

In order to apply conventional forming processes at the micro scale, the size effects caused by material properties and frictional effects must be taken into account. In this research, the effects of tool surface properties such as punch surface grooves on microextrudability, assessed using extrusion force, shape of the extrusion, and Vickers hardness, were investigated using an AA6063 billet. Microscale grooves of 5 to 10 µm were fabricated on the punch surface. The extrusion force increased rapidly as the stroke progressed for all the grooves. Comparing the product geometries showed that, the smaller the groove size, the lower the adhesion and the longer the backward extrusion length. The results of material analysis using EBSD showed that a 5 µm groove depth punch improved the material flowability and uniformly introduced more strain. On the other hand, material flowability was reduced and strain was applied nonuniformly when a mirror-finish tool was used. Therefore, the tribology between the tool and the material was controlled by changing the surface properties of the punch to improve formability.

リンク情報
DOI
https://doi.org/10.3390/mi12111299 本文へのリンクあり
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000725142500001&DestApp=WOS_CPL
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85118181366&origin=inward 本文へのリンクあり
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=85118181366&origin=inward
ID情報
  • DOI : 10.3390/mi12111299
  • eISSN : 2072-666X
  • ORCIDのPut Code : 101984623
  • SCOPUS ID : 85118181366
  • Web of Science ID : WOS:000725142500001

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