2002年
Study of damage formation by low-energy boron cluster ion implantation
Proceedings of the International Conference on Ion Implantation Technology
- ,
- ,
- 巻
- 22-27-
- 号
- 開始ページ
- 560
- 終了ページ
- 563
- 記述言語
- 英語
- 掲載種別
- DOI
- 10.1109/IIT.2002.1258066
- 出版者・発行元
- Institute of Electrical and Electronics Engineers Inc.
Cluster ion implantation using small boron cluster, decaborane (B10H14), has been proposed as the solution for shallow junction formation. Investigation of damage formation process by low-energy ion impact is important issue because diffusion and activation mechanism of dopant depend on the structure of defects in the substrate. In order to study difference of damage characteristics between monomer and cluster implantation, the molecular dynamics simulation of low-energy boron monomer and cluster (such like B4, B8 and B10) implantation into silicon substrate were performed. Additionally damage induced by boron monomer and cluster ion beam implantation is examined using RBS channeling method. From both simulation and experimental results, the amount and structure of defects caused by boron monomer/cluster implantation were discussed.
- リンク情報
- ID情報
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- DOI : 10.1109/IIT.2002.1258066
- SCOPUS ID : 84961342715