Kai Takeuchi

Profile Information

Affiliation: Assistant Professor, Department of Electronic Engineering, Graduate School of Engineering, Tohoku University

Degree: Ph.D. Engineering(Apr, 2020, The University of Tokyo)

Researcher number: 20896716
ORCID iD: https://orcid.org/0000-0002-5700-3662
J-GLOBAL ID: 202101010601930314
researchmap Member ID: R000023707

Research Interests

Research Areas

Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Electronic devices and equipment /

Research History

Aug, 2022 - Present

Assistant Professor, Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
Oct, 2021 - Jul, 2022

Project Researcher, System Design Lab, School of Engineering, The University of Tokyo
Aug, 2020 - Jul, 2022

Collaborative Researcher, Institute of Industrial Science, The University of Tokyo
Apr, 2020 - Jul, 2022

Senior Researcher, Collaborative Research Center, Meisei University

Education

Apr, 2017 - Mar, 2020

Department of Precision Engineering, The Graduate School of Engineering, The University of Tokyo
Apr, 2015 - Mar, 2017

Department of Precision Engineering, The Graduate School of Engineering, The University of Tokyo
Apr, 2011 - Apr, 2015

Department of Precision Engineering, The Faculty of Engineering, The University of Tokyo

Committee Memberships

Jun, 2024 - Present

接合界面創成技術研究会幹事, 一般社団法人電子実装工学研究所 (IMSI)
Sep, 2023 - Present

International Conference on Electronics Packaging (ICEP) 論文副委員長
Jun, 2023 - Present

BoGメンバー, IEEE EPS Japan Chapter
Jan, 2023 - Present

IEEE EPS Symposium Japan (ICSJ) 運営委員
Jan, 2024 - Dec, 2024

第41回「センサ・マイクロマシンと応用システム」シンポジウム運営委員幹事
Mar, 2023 - Dec, 2023

第40回「センサ・マイクロマシンと応用システム」シンポジウム運営委員副幹事, 電気学会
Aug, 2022 - Jun, 2023

International Conference on Electronics Packaging (ICEP) 2023 論文委員

Awards

Major Papers

Room temperature wafer bonding through conversion of polysilazane into SiO2

Kai Takeuchi, Tadatomo Suga, Eiji Higurashi

Scientific Reports, 14(1), Jan, 2024 Peer-reviewedLead authorCorresponding author
Room temperature bonding of Au assisted by self-assembled monolayer

Kai Takeuchi, Junsha Wang, Beomjoon Kim, Tadatomo Suga, Eiji Higurashi

Applied Physics Letters, 122(5) 051603-051603, Jan 30, 2023 Peer-reviewedLead author
Quantification of wafer bond strength under controlled atmospheres

Kai Takeuchi, Tadatomo Suga

JAPANESE JOURNAL OF APPLIED PHYSICS, 61(SF), Jun, 2022 Peer-reviewedLead author
Microfluidic chip connected to porous microneedle array for continuous ISF sampling

Kai Takeuchi, Nobuyuki Takama, Kirti Sharma, Oliver Paul, Patrick Ruther, Tadatomo Suga, Beomjoon Kim

DRUG DELIVERY AND TRANSLATIONAL RESEARCH, 12(2) 435-443, Feb, 2022 Peer-reviewedLead author
Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass

Kai Takeuchi, Fengwen Mu, Akira Yamauchi, Tadatomo Suga

ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 10(5), May, 2021 Peer-reviewedLead author
Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer

Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto, Tadatomo Suga

ADVANCED MATERIALS INTERFACES, 8(5), Mar, 2021 Peer-reviewedLead author
Flexible and porous microneedles of PDMS for continuous glucose monitoring

Kai Takeuchi, Nobuyuki Takama, Rie Kinoshita, Teru Okitsu, Beomjoon Kim

BIOMEDICAL MICRODEVICES, 22(4), Nov, 2020 Peer-reviewedLead author
Microfluidic chip to interface porous microneedles for ISF collection

Kai Takeuchi, Nobuyuki Takama, Beomjoon Kim, Kirti Sharma, Oliver Paul, Patrick Ruther

BIOMEDICAL MICRODEVICES, 21(1), Mar, 2019 Peer-reviewedLead author

Misc.

Au flat micro-bump arrays fabricated by transfer and coining of Au thin films

後藤慎太郎, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 日暮栄治

マイクロエレクトロニクスシンポジウム論文集, 34th, 2024
Surface smoothing of Au plated films by template stripping using polyimide films

小関奨吾, 荻野美佳, 竹内魁, LE Hac Huong Thu, 松前貴司, 高木秀樹, 倉島優一, 津田貴大, 清水寿和, 徳久智明 …

エレクトロニクス実装学会講演大会講演論文集(CD-ROM), 38th, 2024
Effect of Water on Wafer Bonding Interface

Kai Takeuchi

Journal of The Japan Institute of Electronics Packaging, 26(5) 434-440, Aug 1, 2023 Lead authorLast authorCorresponding author
Passivation of Activated Au Surface for Low Temperature Bonding

竹内魁, 日暮栄治, KIM Beomjoon, WANG Junsha, 須賀唯知

センサ・マイクロマシンと応用システムシンポジウム(CD-ROM), 40th, 2023
2nd quantized state oscillation in a gain switched 925nm-band QW-LD and its suppression

古戸颯真, CUI Yuwen, 竹内魁, 山田博仁, 横山弘之, 日暮栄治

応用物理学会秋季学術講演会講演予稿集(CD-ROM), 84th, 2023
Progress and future perspective of room-temperature bonding technologies for heterogeneous integration

日暮栄治, 竹内魁

電子情報通信学会技術研究報告(Web), 123(142(CPM2023 10-22)), 2023
Second-quantized-state laser oscillation dynamics of a 925nm-band QW-LD under strong pulsed excitation

CUI Y., 安食聡一郎, 竹内魁, 竹内魁, 日暮栄治, 日暮栄治, 山田博仁, 山田博仁, 山田博仁, 横山弘之 …

応用物理学会春季学術講演会講演予稿集(CD-ROM), 70th, 2023
GaN/カーボン材料の低熱抵抗界面を目的としたAu低温接合

竹内魁, 須賀唯知, 田中敦之, 分島彰男

精密工学会学術講演会講演論文集, 2021S 699-700, Mar 3, 2021
アルミシリケートガラスの低温接合のためのシーケンシャルプラズマ活性化のAl₂O₃への影響

竹内魁, 須賀唯知

エレクトロニクス実装学術講演大会講演論文集, 35 18C4-05, 2021
表面活性化によるGaN/カーボン材のAu層を介した低温接合

竹内魁, 須賀唯知, 田中敦之, 分島彰男

エレクトロニクス実装学術講演大会講演論文集, 35 17A3-03, 2021
SiC/Ni中間層を用いたGaN基板の常温接合

竹内魁, 須賀唯知, Mu Fengwen, 魚本幸, 島津武仁

エレクトロニクス実装学術講演大会講演論文集, 35 17A3-04, 2021
表面活性化による異種材料接合と界面形成—Bonding and Interfaces of Dissimilar Materials by Means of Surface Activation Method—特集セラミックスコーティングの新潮流 : 界面制御が拓く新しい機能

須賀唯知, 竹内魁

Ceramics Japan = セラミックス : bulletin of the Ceramic Society of Japan, 55(10) 716-719, Oct, 2020
Functionalized microneedles for continuous glucose monitoring

Kai Takeuchi, Beomjoon Kim

NANO CONVERGENCE, 5, Oct, 2018
Fabrication of biodegradable porous microneedle

Morishita Yasuhisa, Takeuchi Kai, Takama Nobuyuki, Kim Beomjoon

Proceedings of JSPE Semestrial Meeting, 2018 734-735, 2018
Direct Bonding and Debonding of PI film and Glass Wafer using Si intermediate layer for TFT fabrication

Proceedings of JIEP Annual Meeting, 29 537-540, 2015

Teaching Experience

Oct, 2023 - Present

学生実験A (東北大学)
Apr, 2023 - Present

学生実験D (東北大学)

Professional Memberships

Jan, 2023 - Present

IEEE EPS
Jan, 2023 - Present

The Institute of Electrical Engineers of Japan
Mar, 2021 - Present

エレクトロニクス実装学会
Mar, 2021 - Present

精密工学会

Research Projects

Creation of fundamental technology on room-temperature bonding through nano-interface control

Grants-in-Aid for Scientific Research, Grant-in-Aid for Scientific Research (B), Japan Society for the Promotion of Science, Apr, 2024 - Mar, 2026
ナノ界面制御による常温接合基盤技術の創出

科学研究費助成事業, 基盤研究(B), 日本学術振興会, Apr, 2023 - Mar, 2026

日暮栄治, 竹内魁
常温接合技術に基づく耐腐食性接合界面の創出

科学研究費助成事業若手研究, 若手研究, 日本学術振興会, Apr, 2023 - Mar, 2026

竹内魁
高出力用光学素子実装のための直接接合技術の開発

奨励研究助成（若手研究者枠）, 公益財団法人天田財団, Oct, 2021 - Mar, 2024

竹内魁
光学素子実装のための酸化アルミニウム中間層を介したガラス材料の常温透明接合

研究助成, 助成金, 公益財団法人精密測定技術振興財団, Apr, 2021 - Mar, 2022

竹内魁

Profile Information

Research Interests

Research Areas

Research History

Education

Committee Memberships

Awards

Major Papers

Misc.

Teaching Experience

Professional Memberships

Research Projects

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Coauthors