2011年
Depth Measurement of Through-Silicon Via Using THz Time-Domain Spectroscopy
2011 36TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ)
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- 記述言語
- 英語
- 掲載種別
- 研究論文(国際会議プロシーディングス)
- 出版者・発行元
- IEEE
We propose a non-destructive method to measure a depth of Through-Silicon Via (TSV) using Terahertz Time-Domain Spectroscopy (THz-TDS). TSV with high aspect ratio could be measured from the phase-shift of transmitted THz pulse. We also succeeded in imaging the difference between two areas corresponding to TSVs and unprocessed Si wafer.
- リンク情報
- ID情報
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- ISSN : 2162-2027
- Web of Science ID : WOS:000330296300207