安田 清和

高フルエンスEUV光による材料表面改質 (短波長量子ビーム発生と応用) 

レーザー学会研究会報告 = Reports on topical meeting of the Laser Society of Japan 16(70) 1-5 2016年12月15日  

Micro Bump Formation by Self-Replication Method 

Proc. International Conference on Electronics Packaging 2010 (ICEP2010), pp.185-189 185-189 2010年  

Self-Replicating Process for Micro Interconnect Array Pattern Using Solder/Polymer Hybrid Materials 

Proc. 60th Electronic Components & Technology Conference 2010 (ECTC2010) pp.1416-1421 1416-1421 2010年  

Process Design of Self-Replication for Micro Bump Formation 

Proceedings of IEEE CPMT Symposium Japan (10th VLSI Packaging Workshop in Japan) 118-121 2010年  

Analysis of Macroscopic Self-Organization Process in the Hybrid System on Low Melting Point Solder and Polymeric Materials 

Proc. of the 20th Microelectronics Symposium 223-226 2010年  

Electro-Mechanical Evaluation of Bio-Interface Material with Self-Restoring Characteristics 

Proc. of 20th Microelectronics Symposium 207-210 2010年  

Smart Processing for Micro Interconnects by Self-Replication 

Proceedings of Materials Science and Technology (MS&T) 2010 2743-2751 2010年  

Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate 

Proceedings of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2010) 2 29-30 2010年  

Filler Motion Dynamics in Resin for Flip Chip Micro Interconnects 

Proc. International Conference on Electronics Packaging 2009 (ICEP2009), pp.939-942 939-942 2009年  

Solder Filler Motion Driven by Interfacial Tension in Self-Organization Assembly Process 

J. Solid Mechanics and Materials Engineering 3(12) 1356-1362 2009年