2010年
Dynamic mechanical behavior of Sn-Ag-Cu lead-free solders by tensile test under high strain rate
Proceedings of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2010)
- 巻
- 2
- 号
- 開始ページ
- 29
- 終了ページ
- 30