Kiyokazu Yasuda
(安田 清和)
Modified on: 01/17
Profile Information
- Affiliation
- Associate Professor, Graduate School of Engineering, Osaka University
- Degree
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Dr. Eng.(Mar, 2001, Osaka Univeristy)
- Researcher number
- 00210253
- J-GLOBAL ID
- 200901003945183940
- researchmap Member ID
- 1000030657
- External link
I am a researcher of materials and manufacturing science and engineering who devotes himself to nature-inspired material processing and smart micro-systems.
Research Interests
21Research Areas
10Research History
8-
Apr, 2012 - Present
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Apr, 2017 - Mar, 2020
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Apr, 2009 - Mar, 2012
Education
2-
Apr, 1986 - Mar, 1988
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Apr, 1982 - Mar, 1986
Awards
7-
May, 2010
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Sep, 2008
Papers
257-
Journal of Japan Institute of Copper, 62(1) 196-199, Aug, 2023 Peer-reviewedLead author
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Polymers, 14(23) 5235-5235, Dec 1, 2022 Peer-reviewedCorresponding author
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Nanomaterials, 12(23) 4241-4241, Nov 29, 2022 Peer-reviewed
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Materials & Design, 220 110873-110873, Aug, 2022 Peer-reviewed
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Nanomaterials, 12(13) 2312-2312, Jul 5, 2022 Peer-reviewed
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Surface and Coatings Technology, 435 128253-128253, Apr, 2022 Peer-reviewed
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Surfaces and Interfaces, 28 101620-101620, Feb, 2022 Peer-reviewed
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Materials Letters, 308 131121-131121, Feb, 2022 Last author
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Micromachines, 12(7) 750-750, Jun 26, 2021 Peer-reviewed
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2021 International Conference on Electronics Packaging (ICEP), 11-12, May 12, 2021 Peer-reviewed
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Proc. 2021 International Conference on Electronics Packaging (ICEP), 53-54, May 12, 2021 Peer-reviewedLead authorCorresponding author
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Proc. 27th Symposium on "Microjoining and Assembly Technology in Electronics", 27 231-232, Feb, 2021
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Nanomaterials, 10(8) 1456-1456, Jul 25, 2020 Peer-reviewedLast author
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Polymers, 69(2) 57-59, Feb, 2020 Peer-reviewedInvitedLead authorCorresponding author
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Proc. 29th Microelectronics Symposium, 29 23-26, Sep, 2019 Peer-reviewedLast author
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Proc. the 8th International Congress on Laser Advanced Materials Processing (LAMP2019), Sep, 2019 Peer-reviewed
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Journal of The Japan Institute of Electronics Packaging, 22(5) 395-399, Aug, 2019 Peer-reviewedInvited
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2018 IEEE CPMT Symposium Japan (ICSJ), 135-138, Nov, 2018 Peer-reviewedLast author
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Direct Joining of Carbon Fiber Reinforced Thermoplastics and Magnesium Alloys by Thermal CompressionPreprints of the National Meeting of JWS, 2018f 424-425, Sep, 2018 Lead authorCorresponding author
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Preprints of the National Meeting of JWS, 2018f 208-209, Sep, 2018 Last author
Misc.
25-
16(70) 1-5, Dec 15, 2016
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87 348-349, Aug 18, 2010
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Proc. International Conference on Electronics Packaging 2010 (ICEP2010), pp.185-189, 185-189, 2010
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Proc. 60th Electronic Components & Technology Conference 2010 (ECTC2010) pp.1416-1421, 1416-1421, 2010
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Proceedings of IEEE CPMT Symposium Japan (10th VLSI Packaging Workshop in Japan), 118-121, 2010
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Proc. of the 20th Microelectronics Symposium, 223-226, 2010
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Proc. of 20th Microelectronics Symposium, 20 207-210, 2010
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Proceedings of Materials Science and Technology (MS&T) 2010, 2743-2751, 2010
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Proceedings of the International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2010), 2 29-30, 2010
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Proc. International Conference on Electronics Packaging 2009 (ICEP2009), pp.939-942, 939-942, 2009
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J. Solid Mechanics and Materials Engineering, 3(12) 1356-1362, 2009
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17 231-234, Sep 13, 2007
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79 420-421, Sep 1, 2006
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Pre-Prints of the National Meeting of JWS, (77) 58-59, Aug 20, 2005
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Pre-Prints of the National Meeting of JWS, (77) 56-57, Aug 20, 2005
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Pre-Prints of the National Meeting of JWS, (77) 66-67, Aug 20, 2005
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Pre-Prints of the National Meeting of JWS, 77 50-51, 2005
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Pre-Prints of the National Meeting of JWS, (75) 164-165, Aug 20, 2004
Books and Other Publications
3-
大阪大学出版会, Mar 28, 2014 (ISBN: 4872594738) -
名古屋大学メディカルエンジニアリング編集委員会, Mar, 2013
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Jan, 2012
Presentations
1-
International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT2018), Oct. 24-26 Taipei, Oct 25, 2018 Invited
Major Teaching Experience
14-
Oct, 2016 - Present
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Oct, 2015 - Present
Major Professional Memberships
11-
Apr, 1988 - Present
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Apr, 2000 - Present
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Apr, 2002 - Present
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Sep, 2002 - Present
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Jan, 2004 - Present
Research Projects
16-
Grant-in-Aid for Scientific Research, 2008 - 2011
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2010 - 2010
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Grants-in-Aid for Scientific Research(基盤研究(C)), Ministry of Education, Culture, Sports, Science and Technology, 2008 - 2010
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Grants-in-Aid for Scientific Research(基盤研究(A)), Ministry of Education, Culture, Sports, Science and Technology, 2007 - 2009
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Grants-in-Aid for Scientific Research(基盤研究(B)), Ministry of Education, Culture, Sports, Science and Technology, 2001 - 2002
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Grants-in-Aid for Scientific Research(基盤研究(C)), Ministry of Education, Culture, Sports, Science and Technology, 1999 - 2000
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Grants-in-Aid for Scientific Research(基盤研究(B)), Ministry of Education, Culture, Sports, Science and Technology, 1995 - 1996
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科学研究費補助金(一般研究(C)), 文部科学省, 1993 - 1993
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Grants-in-Aid for Scientific Research(一般研究(C)), Ministry of Education, Culture, Sports, Science and Technology, 1991 - 1992
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Grants-in-Aid for Scientific Research(一般研究(A)), Ministry of Education, Culture, Sports, Science and Technology, 1989 - 1991
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科学研究費補助金(一般研究(C)), 文部科学省, 1989 - 1989
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共同研究, 名古屋大学エコトピア科学研究所
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共同研究, 大阪大学レーザーエネルギー学研究センター
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