2003年6月
逐次2点法によるシリコン基板の平面形状測定に関する研究(第1報 支持条件を考慮した直径及び外円周形状測定
日本機械学会論文集C編
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- 巻
- 69
- 号
- 682
- 開始ページ
- 1618
- 終了ページ
- 1625
- 記述言語
- 日本語
- 掲載種別
- 研究論文(学術雑誌)
- 出版者・発行元
- 一般社団法人日本機械学会
In the progress of semiconductor technology, the diameters of Si substrates are increasing and the flatness accuracy is being raised. However, the evaluation method has not been accomolished. The sequential-two-points method, which was originally developed to evaluate straightness error motion of the tool as well as error profile of machined parts in machine tool, is applied to evaluate surface form of the flatness on the substrates. Forms along diameters and periphery are measured as a step to construct form of flatness on polar coordinate. Resolution of the capacitor type sensors are calibrated with order of nm, so that the measurable accuracy, of the method is assured and the straightness error from of 0.3 μm along diameter have been obtained, on the other hand which can be easily deformed by boundary conditions of support.
- リンク情報
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- CiNii Articles
- http://ci.nii.ac.jp/naid/110002379038
- CiNii Books
- http://ci.nii.ac.jp/ncid/AN00187463
- URL
- http://id.ndl.go.jp/bib/6630767
- ID情報
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- ISSN : 0387-5024
- CiNii Articles ID : 110002379038
- CiNii Books ID : AN00187463