MISC

査読有り
2016年7月

Oxygen additive amount dependence of rate of photoresist removal by H radicals generated on a tungsten hot-wire catalyst

Japanese Journal of Applied Physics
  • Masashi Yamamoto
  • ,
  • Hironobu Umemoto
  • ,
  • Keisuke Ohdaira
  • ,
  • Tomokazu Shikama
  • ,
  • Takashi Nishiyama
  • ,
  • Hideo Horibe

55
7
開始ページ
076503.1‐076503.5
終了ページ
記述言語
英語
掲載種別
DOI
10.7567/JJAP.55.076503
出版者・発行元
IOP PUBLISHING LTD

© 2016 The Japan Society of Applied Physics. We examined an environmentally friendly photoresist removal method using radicals produced by decomposing mixtures of hydrogen and oxygen on a hot tungsten catalyst. The photoresist removal rate increased with the oxygen additive amount (the flow rate ratio of oxygen to hydrogen) up to an optimal amount and then decreased gradually. When the catalyst temperature was 1600°C, the optimal oxygen additive amount was 1.0% and the removal rate was 1.7 times higher than that in the pure hydrogen system. At 2000°C, the optimal amount increased to 2.5% but the increase ratio decreased by 1.3 times. At high catalyst temperatures, the absolute removal rate as well as the optimal oxygen additive amount is high, but the increase ratio is low. At the optimal oxygen additive amount, H, O, and OH radicals may exert their effects together to decompose photosensitive polymers.

リンク情報
DOI
https://doi.org/10.7567/JJAP.55.076503
J-GLOBAL
https://jglobal.jst.go.jp/detail?JGLOBAL_ID=201702233617692149
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000379384600030&DestApp=WOS_CPL
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84976509882&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=84976509882&origin=inward
URL
http://jglobal.jst.go.jp/public/201702233617692149
ID情報
  • DOI : 10.7567/JJAP.55.076503
  • ISSN : 0021-4922
  • eISSN : 1347-4065
  • J-Global ID : 201702233617692149
  • SCOPUS ID : 84976509882
  • Web of Science ID : WOS:000379384600030

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