Katsumi Miyama

Profile Information

Affiliation: 教授, 工学部機械工学科, 北海道科学大学

Degree: 博士（工学）(Mar, 2013, 北海道工業大学)

Researcher number: 70540186
J-GLOBAL ID: 202001008059641708
researchmap Member ID: R000014275

External link: https://labs.hus.ac.jp/details.php?id=131/

Research Interests

Research Areas

Manufacturing technology (mechanical, electrical/electronic, chemical engineering) / Electronic devices and equipment / Printed wiring board, Fine pattern, 3-D wiring
Nanotechnology/Materials / Material fabrication and microstructure control / Interface, Residual stress, Reacted Products, Surface treatment

Research History

Apr, 2014 - Present

Hokkaido University of Science
Apr, 2013 - Mar, 2014

The Faculty of Advanced Engineering Department of Mechanical Systems Engineering, Hokkaido Institute of Technology
Apr, 2010 - Mar, 2013

The Faculty of Advanced Engineering Department of Mechanical Systems Engineering, Hokkaido Institute of Technology
Dec, 1998 - Mar, 2010

Clover Electronics Co., Ltd
Jul, 1995 - Nov, 1998

札幌高級鋳物株式会社
Apr, 1987 - Jun, 1995

NGK Spark Plug Co., Ltd.

Education

- Mar, 1987

School of Engineering, Hokkaido University

Committee Memberships

Jan, 2020 - Present

北海道・東北支部長, エレクトロニクス実装学会
Jan, 2019 - Dec, 2020

北海道支部長, 表面技術協会
Jan, 2018 - Dec, 2019

北海道支部長, 腐食防蝕学会

Awards

Apr, 2018

Outstanding Technical Paper Awards of ICEP 2017,, Effects of External Bending Stress on Device-Embedded Substrate, The Japan Institute of Electronics Packaging

Katsumi Miyama, Yoshihisa Katoh
Mar, 2018

溶接技術奨励賞, 一般社団法人溶接学会
Mar, 2017

第30回エレクトロニクス実装学会春季講演大会優秀賞, 一般社団法人エレクトロニクス実装学会

見山克己,加藤義尚,友景肇,高橋寿文,杉本光祐

Papers

形削り盤を利用したやすり加工性能試験装置の開発—Development of the file performance tester based on the shaper

吉田協, 見山克己

Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology, 67(3) 143-149, Mar, 2023
Optimization of Bonding and Sizing Process for Automotive Wet Clutch Discs applying "Robust Design"

EIJI TOMA, Katsumi Miyama

Journal of the Institute of Industrial Applications Engineers, 8(2) 73-83, Apr 25, 2020
Fabrication of Artificial Delamination Flaw Specimens and an Application of Active Thermography

MIYAMA Katsumi, YOSHIDA Kanou, OKUMURA Mitsunori, SAKURABA Yohei, TANAKA Hiroyuki, AIYAMA Hideaki

Journal of The Japanese Society for Non-Destructive Inspection, 69(7) 333-339, 2020
Optimization of Flight Stability of Water Rockets by Integrated Analysis of "Dynamic Simulation System" and "Robust Design"

Toma Eiji, Miyama Katsumi, Iuchi Satoshi

The Japanese Journal of the Institute of Industrial Applications Engineers, 8(1) 28-38, 2020
Planning and Practice of a New Group Working Program for Freshmen of Mechanical Engineering Department

MATSUDA Hisashi, HIRAMOTO Riho, MIYAMA Katsumi, TAKEZAWA Satoshi

Journal of JSEE, 67(3) 3_33-3_37, 2019
Effects of External Bending Stress on Characteristic Change of Embedded Device

Miyama Katsumi, Katoh Yoshihisa

Transactions of The Japan Institute of Electronics Packaging, 10 E17-001-1-E17-001-6, 2017
Layer Structure of the χ-phase Film in the Re-Nb System Formed on Nb Substrate Induced by Cr-Pack Cementation

Saito Shigeru, Takashima Toshiyuki, Miyama Katsumi, Narita Toshio

Journal of the Japan Institute of Metals and Materials, 80(6) 350-354, 2016
Modeling of Cutting Mechanism Considering the Effect of Surface Plastic Flow on Chip Thickness

YOSHIDA Kanou, MINATO Junichiro, MIYAMA Katsumi, SAITO Shigeru, TAKASHIMA Toshiyuki

Journal of the Japan Society for Precision Engineering, 82(3) 291-297, 2016
Effects of Internal Stress of Electroless Nickel Plating on Solder Joining Strength

Miyama Katsumi, Yoshida Kanou, Saitou Shigeru, Takashima Toshiyuki

Transactions of The Japan Institute of Electronics Packaging, 8(1) 1-7, 2015
Formation of Inter-Diffusion Layer between NiCrAlY Coating and Nb Substrate during Vacuum Heat-Treatment

Saito Shigeru, Takashima Toshiyuki, Miyama Katsumi, Narita Toshio, Zhao Linruo

MATERIALS TRANSACTIONS, 56(3) 367-371, 2015
Fabrication of Fine Copper Structure on Both Sides by Thermal Nanoimprint

SAITOU Takayuki, KATAYAMA Naoki, MIYAMA Katsumi, YAJIMA Masaki, WATANABE Hideo

Journal of The Surface Finishing Society of Japan, 66(9) 425-430, 2015
Effects of Internal Stress of Electroless Nickel Plating on Solder Joining Strength

Miyama Katsumi, Yoshida Kanou, Saitou Shigeru, Takashima Toshiyuki

Journal of The Japan Institute of Electronics Packaging, 18(4) 253-260, 2015
Experimental Determination of the Isothermal Section in a Ternary Re–Cr–Nb System at 1500°C

Saito Shigeru, Takashima Toshiyuki, Miyama Katsumi, Narita Toshio, Nagata Taiichi, Masuda Ideo, Kajiwara Kenichi

MATERIALS TRANSACTIONS, 55(2) 298-303, 2014
Formation of Inter-Diffusion Layer between NiCrAlY Coating and Nb Substrate during Vacuum Heat-Treatment

Saito Shigeru, Takashima Toshiyuki, Miyama Katsumi, Narita Toshio, Zhao Linruo

Journal of the Japan Institute of Metals and Materials, 78(9) 359-363, 2014
Experimental Determination of Isothermal Section at 1500℃ in the Ternary Re-Cr-Nb System

SAITO Shigeru, TAKASHIMA Toshiyuki, MIYAMA Katsumi, NARITA Toshio, NAGATA Taiichi, MASUDA Ideo, KAJIWARA Kenichi

Journal of the Japan Institute of Metals and Materials, 77(10) 424-429, Oct 1, 2013
Influence of Substrate Structure on Reliability of Bare Die Embedding Substrate

MIYAMA Katsumi, TAKAHASHI Hisafumi, IWATA Tomoyuki, TANAKA Hiroyuki

Journal of The Japan Institute of Electronics Packaging, 15(7) 550-557, Nov 1, 2012
Tie-Line Compositions of the σ and (γ, δ) Phases in the Re-Cr-Ni System at 1573K

SAITO Shigeru, TAKASHIMA Toshiyuki, MIYAMA Katsumi, KUROKAWA Kazuya, NARITA Toshio

MATERIALS TRANSACTIONS, 52(12) 2174-2177, Dec 1, 2011
Tie-Lined Compositions of the γ and δ Phases in the Binary Re-Ni System

SAITO Shigeru, TAKASHIMA Toshiyuki, MIYAMA Katsumi, KUROKAWA Kazuya, NARITA Toshio

Journal of the Japan Institute of Metals and Materials, 75(9) 479-484, Sep 1, 2011
Tie-Lined Compositions of the σ and (γ,δ) Phases in the Re-Cr-Ni System at 1573K

SAITO Shigeru, TAKASHIMA Toshiyuki, MIYAMA Katsumi, KUROKAWA Kazuya, NARITA Toshio

Journal of the Japan Institute of Metals and Materials, 75(6) 361-365, Jun 10, 2011
Fatigue Properties of Ceramic/Metal Joints under Cyclic Rotary Bending Stress

TANAKA Tomo-o, MIYAMA Katsumi, ITO Masaya

Journal of the Japan Institute of Metals and Materials, 60(7) 660-666, Jul 20, 1996

Misc.

金属積層造形により製作した立体配管への循環めっき処理方法—Circulation Plating Method for the Piping Manufactured by Metal-powder Bed Fusion—特集最近の製造技術の開発と応用

鈴木逸人, 戸羽篤也, 見山克己

化學工業, 73(2) 95-103, Feb, 2022
Joining Interface of Plating and Solder

72(10) 530-536, Oct, 2021
Friction Spot Welding of Hot-dip Galvanized Steel and Aluminum Alloy Sheet

植竹亮太, 吉田協, 見山克己

Symposium on Microjoining and Assembly Technology in Electronics, 27th, 2021
Evaluation of Degradation of Mechanical Properties of Polypropylene for Ankle Foot Orthoses by Thermal Cycle Test

(48) 51-54, Sep 30, 2020
Influence of Construction Temperature of Stud Welding

(48) 39-42, Sep 30, 2020
Formation Behavior of Reacted Products in Resistance-spot Welding of Steel and Aluminum alloy

(48) 55-58, Sep 30, 2020
Trend of Wiring Densification of Printed Wiring Board and Jisso

71(9) 565-568, Sep, 2020
Development of File Cutting Test Device using Shaper

(47) 45-51, Sep 24, 2019
A Resistance Spot Welding of the galvanized steel sheet and the aluminum alloy for automobile（Ⅱ）

(47) 39-43, Sep 24, 2019
Effect of Construction Temperature and Plate Thickness on Hardness of Welded Zones of Stud Welding

(47) 5-11, Sep 24, 2019
畜舎内の腐食ガス環境下における鋼材の表面仕上げと腐食に関する研究第１報 2年7ヶ月曝露後の腐食状況

前田憲太郎, 田沼吉伸, 高橋圭二, 齋藤繁, 見山克己

日本建築学会北海道支部研究報告集, (92) 17-20, Jun 29, 2019
Resistance Spot Welding of the Galvanized Steel Sheet and the Aluminum Alloy for Automobile

57(2) 60-66, Feb, 2019
畜舎内の腐食ガス環境下における鋼材の腐食に関する研究

前田憲太郎, 高橋圭二, 齋藤繁, 田沼吉伸, 見山克己

北海道科学大学研究紀要(Web), (47), 2019
Development of File Cutting Test Device using Shaper

(47) 43-49, 2019
Non-destructive Testing of Material Flaw with Active Thermography

(47) 19-24, 2019
Study on Corrosion of Steel Products under Corrosive Gas in Barn

(47) 25-30, 2019
Effect of Construction Temperature and Plate Thickness on Hardness of Welded Zones of Stud Welding

(47) 5-11, 2019
A Resistance Spot Welding of the galvanized steel sheet and the aluminum alloy for automobile(2)

(47) 39-42, 2019
Resistance Spot Welding of the galvanized steel sheet and the aluminum alloy for automobile

(45) 99-106, 2018
Macrostructure and Hardness of Welded Zone in Stud-Welded Specimen under Low-Temperature Environment

(44) 1-7, 2017

Presentations

1B06 Planning and Practice of a New Group Working Program for Fresh-men of Mechanical Engineering Department

MATSUDA Hisashi, HIRAMOTO Riho, MIYAMA Katsumi, TAKEZAWA Satoshi

Proceedings of Annual Conference of Japanese Society for Engineering Education, 2019, Japanese Society for Engineering Education
2E01 Study on Tool Wear of File at Machine Shop Practice (3^rd Report):Single Cut File used for Cutting Cycle Test of S25C

YOSHIDA Kanou, MIYAMA Katsumi, SATO Yuko

Proceedings of Annual Conference of Japanese Society for Engineering Education, 2018, Japanese Society for Engineering Education
Effect of substrate construction on stress/strain distribution and deformation of the device-embedded substrates

Proceedings of JIEP Annual Meeting, 2018, The Japan Institute of Electronics Packaging
Non-destructive Inspection of Material Flaws with Active Thermography

MIYAMA Katsumi, YOSHIDA Kanou, ICHINOHE Yoshihiro, SAKURABA Yohei, TANAKA Hiroyuki

The Proceedings of Conference of Hokkaido Branch, 2018, The Japan Society of Mechanical Engineers
Relationship between Cutting Force and the Workpiece Hardness of the File

YOSHIDA Kanou, MIYAMA Katsumi, SATO Yuko

The Proceedings of Conference of Hokkaido Branch, 2018, The Japan Society of Mechanical Engineers
1A08 Study on Tool Wear of File at Machine Shop Practice (2nd Report)

YOSHIDA Kanou, MIYAMA Katsumi

Proceedings of Annual Conference of Japanese Society for Engineering Education, 2017, Japanese Society for Engineering Education
Modelling Conditions of Maraging Steel by Metallic Powder Selective Laser Melting

TOBA Atsuya, Suzuki Hayato, HIRANO Shigeki, MIYAMA Katsumi, TAKEDA Tadashi, HASHIZUME Shun

The Proceedings of Mechanical Engineering Congress, Japan, 2017, The Japan Society of Mechanical Engineers
Effect of flow volume on plating thickness of inside pipe surface in the circulatory plating method

SUZUKI Hayato, TOBA Atsuya, MIYAMA Katsumi

The Proceedings of Mechanical Engineering Congress, Japan, 2017, The Japan Society of Mechanical Engineers
Effect of resin characteristic and board configuration on bending displacement of device embedded substrate

Proceedings of JIEP Annual Meeting, 2017, The Japan Institute of Electronics Packaging
2A11 Study on Tool Wear of File at Machine Shop Practice

YOSHIDA Kanou, MIYAMA Katsumi

Proceedings of Annual Conference of Japanese Society for Engineering Education, 2016, Japanese Society for Engineering Education
The effects of pipe modeling directions on plating adhesion in selective laser melting methods

SUZUKI Hayato, TOBA Atsuya, MIYAMA Katsumi

The Proceedings of Mechanical Engineering Congress, Japan, 2016, The Japan Society of Mechanical Engineers
2A23 Skill Level of Machine Shop Practice

YOSHIDA Kanou, KITAGAWA Hiroshi, HIRAMOTO Riho, SAITO Shigeru, MIYAMA Katsumi, TAKASHIMA Toshiyuki

Proceedings of Annual Conference of Japanese Society for Engineering Education, 2014, Japanese Society for Engineering Education
Influence of Construction Temperature on Hardness of Welded Zones of Stud Welding

MAEDA Kentaro, TANUMA Yoshinobu, TAKASHIMA Toshiyuki, MIYAMA Katsumi, SAITO Shigeru, KITAGAWA Hiroshi, KUSAKARI Toshio

Preprints of the National Meeting of JWS, 2014, JAPAN WELDING SOCIETY
2-102 Investigation of the Basic Scholarship and First Year Education at Hokkaido Institute of Technology

MITAMURA Tamotsu, MIYAMA Katsumi, TSUKAGOSHI Kumiko, TAKAMURA Masashi, AKIYAMA Toshiharu

Proceedings of Annual Conference of Japanese Society for Engineering Education, 2013, Japanese Society for Engineering Education
Practical application of device embedded substrate and future issues

Miyama Katsumi

Proceedings of JIEP Annual Meeting, 2011, The Japan Institute of Electronics Packaging
Analysis of bonding part of gold stud bump in bare die embedding substrate

Miyama Katsumi, Tanaka Hiroyuki

Proceedings of JIEP Annual Meeting, 2010, The Japan Institute of Electronics Packaging

Professional Memberships

Research Projects

ナノインプリント法を用いた超微細配線の創製

科学研究費助成事業基盤研究(C), 基盤研究(C), 日本学術振興会, Apr, 2021 - Mar, 2024

見山克己, 齋藤隆之

Profile Information

Research Interests

Research Areas

Research History

Education

Committee Memberships

Awards

Papers

Misc.

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Professional Memberships

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