論文

査読有り
2021年3月

In-situ observation of abnormal grain growth in a low-alloyed carbon steel using SEM-EBSD

Materialia
  • Genki Saito
  • ,
  • Tianglong Zhang
  • ,
  • Norihito Sakaguchi
  • ,
  • Munekazu Ohno
  • ,
  • Kiyotaka Matsuura
  • ,
  • Masayoshi Takeuchi
  • ,
  • Taichi Sano
  • ,
  • Koki Minoguchi
  • ,
  • Takuya Yamaoka

15
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/j.mtla.2020.100985
出版者・発行元
ELSEVIER SCI LTD

Because abnormal grain growth (AGG) degrades mechanical properties of industrial polycrystalline materials such as steel, understanding and controlling AGG are important. In this study, AGG of Al-Nb-microalloyed low-carbon steel was investigated at 1100°C using in-situ scanning electron microscopy-electron backscatter diffraction (SEM-EBSD). Owing to the pinning particles of AlN and Nb(C,N), fine austenite grains formed initially, and AGG appeared owing to the dissolution of the pinning particles at high temperatures. Relatively large grains invaded the surrounding smaller grains with a size ratio of approximately 0.3, resulting in AGG. We developed the in-situ observation method to investigate the AGG of the carburization process using a diffusion couple of high- and low-carbon steels. The carbon diffusion into the low-carbon steel from the high-carbon steel enhanced the grain growth of the low-carbon steel. Although the detailed mechanism is still unclear, we clearly showed that carburization can reduce the pinning force. When focusing on the misorientation of the grain boundary, grain boundaries with misorientation angles of 50–59° remained during AGG, which is explained by their lower mobility owing to their lower grain boundary energy. These results suggest that the difference in grain-boundary mobility can induce duplex grain growth with a bimodal distribution, resulting in AGG.

リンク情報
DOI
https://doi.org/10.1016/j.mtla.2020.100985
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000636280500008&DestApp=WOS_CPL
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85098749318&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=85098749318&origin=inward
ID情報
  • DOI : 10.1016/j.mtla.2020.100985
  • ISSN : 2589-1529
  • eISSN : 2589-1529
  • SCOPUS ID : 85098749318
  • Web of Science ID : WOS:000636280500008

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