高木秀樹 (Hideki Takagi) - マイポータル

基本情報

所属: 独立行政法人産業技術総合研究所集積マイクロシステム研究センター総括研究主幹

学位: 博士（工学）(東京大学)

J-GLOBAL ID: 200901066993451028
researchmap会員ID: 0000010972

外部リンク: http://www.aist.go.jp/RESEARCHERDB/cgi-bin/worker_detail.cgi?call=namae&rw_id=H59731525

研究キーワード

研究分野

論文

138

Wafer-level hermetic vacuum packaging by bonding with a copper-tin thin film sealing ring

Teruhisa Akashi, Hirofumi Funabashi, Hideki Takagi, Yoshiteru Omura, Yoshiyuki Hata

Journal of Micromechanics and Microengineering 28(4) 2018年2月15日査読有り
Surface activated room-temperature bonding in Ar gas ambient for MEMS encapsulation

Hideki Takagi, Yuichi Kurashima, Akifumi Takamizawa, Takeshi Ikegami, Shinya Yanagimachi

Japanese Journal of Applied Physics 57(2) 2018年2月1日査読有り
Room-temperature Au–Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns

Kurashima Y, Matsumae T, Takagi H

Microelectronic Engineering 189 1-5 2018年査読有り
High external quantum efficiency (10%) AlGaN-based deep-ultraviolet light-emitting diodes achieved by using highly reflective photonic crystal on p-AlGaN contact layer

Yukio Kashima, Noritoshi Maeda, Eriko Matsuura, Masafumi Jo, Takeshi Iwai, Toshiro Morita, Mitsunori Kokubo, Takaharu Tashiro, Ryuichiro Kamimura, Yamato Osada …

APPLIED PHYSICS EXPRESS 11(1) 2018年1月査読有り
First Experimental Observation of Channel Thickness Scaling Induced Electron Mobility Enhancement in UTB-GeOI nMOSFETs

Wen Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Hiroyuki Ota, Hideki Takagi, Yuichi Kurashima, Noriyuki Uchida, Tatsuro Maeda

IEEE TRANSACTIONS ON ELECTRON DEVICES 64(11) 4615-4621 2017年11月査読有り
Long-term hermetic vacuum wafer-level packaging with copper-tin thin films

T. Akashi, H. Funabashi, H. Takagi, Y. Hata, Y. Omura, M. Fujiyoshi

TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems 1292-1295 2017年7月26日査読有り
Development of STJ for neutron detector on Si-LBO hybrid substrate by surface-activated room-temperature bonding

S. Endo, G. Fujii, M. Ukibe, H. Takagi, M. Ohkubo, M. Naruse, H. Myoren, C. Otani, T. Taino

Journal of Physics: Conference Series 871(1) 2017年7月26日査読有り
Three-dimensional integration technology of magnetic tunnel junctions for magnetoresistive random access memory application

Kay Yakushiji, Hideki Takagi, Naoya Watanabe, Akio Fukushima, Katsuya Kikuchi, Yuuichi Kurashima, Atsushi Sugihara, Hitoshi Kubota, Shinji Yuasa

APPLIED PHYSICS EXPRESS 10(6) 2017年6月査読有り
Surface activated room-temperature bonding in Ar gas ambience for MEMS encapsulation

Takagi H, Kurashima Y

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 46 2017年査読有り
First experimental observation of channel thickness scaling (down to 3 nm) induced mobility enhancement in UTB GeOI nMOSFETs

Chang W.H, Irisawa T, Ishii H, Hattori H, Ota H, Takagi H, Kurashima Y, Uchida N, Maeda T

Digest of Technical Papers - Symposium on VLSI Technology T192-T193 2017年査読有り
Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air

Kurashima Y, Maeda A, Takagi H

Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 56 2017年査読有り
Preparation of the low cost SiC wafer by the layer splitting method and the wafer direct bonding method

Kawahara T, Hatta N, Sakata T, Minami A, Yagi K, Uchida H, Kobayasi M, Takagi H

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering 83(9) 833-836 2017年査読有り
Advanced germanium layer transfer for ultra thin body on insulator structure

Tatsuro Maeda, Wen-Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Vladimir Poborchii, Yuuichi Kurashima, Hideki Takagi, Noriyuki Uchida

APPLIED PHYSICS LETTERS 109(26) 2016年12月査読有り
Case studies of a planar piezoresistive vibration sensor: Measuring transient time history signal waves

Lan Zhang, Jian Lu, Yuichi Kurashima, Hideki Takagi, Ryutaro Maeda

MICROELECTRONIC ENGINEERING 165 27-31 2016年11月査読有り
Enhancement of mobility in ultra-thin-body GeOI p-channel metal-oxide-semiconductor field effect transistors with Si-passivated back interfaces

Wen-Hsin Chang, Toshifumi Irisawa, Hiroyuki Ishii, Hiroyuki Hattori, Hideki Takagi, Yuichi Kurashima, Tatsuro Maeda

APPLIED PHYSICS EXPRESS 9(9) 2016年9月査読有り
Surface Activated Wafer Bonding; Principle and Current Status

H. Takagi, Y. Kurashima, T. Suga

SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14 75(9) 3-8 2016年査読有り
Room-temperature wafer scale bonding using smoothed Au seal ring surfaces for hermetic sealing

Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi

JAPANESE JOURNAL OF APPLIED PHYSICS 55(1) 2016年1月査読有り
Optimization and evaluation of the size-free integration process for MEMS-IC assembly with high yields and high efficiency

Jian Lu, Hiroyuki Kuwabara, Yuichi Kurashima, Lan Zhang, Hideki Takagi

MICROELECTRONIC ENGINEERING 145 75-81 2015年9月査読有り
Nano-patterning on soluble block copolymer polyimide by nanoimprint

Kenta Suzuki, Sung-Won Youn, Hiroshi Hiroshima, Hideki Takagi

JAPANESE JOURNAL OF APPLIED PHYSICS 54(8) 2015年8月査読有り
Wafer-scale layer transfer of GaAs and Ge onto Si wafers using patterned epitaxial lift-off

Eiko Mieda, Tatsuro Maeda, Noriyuki Miyata, Tetsuji Yasuda, Yuichi Kurashima, Atsuhiko Maeda, Hideki Takagi, Takeshi Aoki, Taketsugu Yamamoto, Osamu Ichikawa …

JAPANESE JOURNAL OF APPLIED PHYSICS 54(3) 2015年3月査読有り

もっとみる

MISC

Room-temperature microfluidics packaging using sequential plasma activation process

M. M. R. Howlader, S. Suehara, H. Takagi, T. H. Kim, R. Maeda, T. Suga

IEEE TRANSACTIONS ON ADVANCED PACKAGING 29(3) 448-456 2006年8月
Direct bonding of two crystal substrates at room temperature by Ar-beam surface activation

Hideki Takagi, Ryutaro Maeda

JOURNAL OF CRYSTAL GROWTH 292(2) 429-432 2006年7月
Aligned room-temperature bonding of silicon wafers in vacuum by argon beam surface activation

H Takagi, R Maeda

JOURNAL OF MICROMECHANICS AND MICROENGINEERING 15(2) 290-295 2005年2月
Si/Si, Si/CuのAr高速原子ビームによる表面活性化常温封止接合

電子情報通信学会論文誌Ｃエレクトロニクス J88-C(11) 913-919 2005年
Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature

H Takagi, R Maeda, T Suga

SENSORS AND ACTUATORS A-PHYSICAL 105(1) 98-102 2003年6月
Room-temperature wafer bonding of Si and lithium niobate by means of argon bean surface activation

INTEGRATED FERROELECTRICS 50 53-59 2002年
Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activation

H Takagi, R Maeda, T Suga

JOURNAL OF MICROMECHANICS AND MICROENGINEERING 11(4) 348-352 2001年7月

所属学協会

共同研究・競争的資金等の研究課題

常温ウェハ接合によるマイクロ接合

共同研究
MEMS

Cooperative Research