論文

査読有り
2019年5月

Effects of Zr and Si addition on high-temperature mechanical properties and microstructure in Ti-10Al-2Nb-based alloys

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
  • Kei Shimagami
  • ,
  • Tsutomu Ito
  • ,
  • Yoshiaki Toda
  • ,
  • Atsushi Yumoto
  • ,
  • Yoko Yamabe-Mitarai

756
開始ページ
46
終了ページ
53
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/j.msea.2019.04.031
出版者・発行元
ELSEVIER SCIENCE SA

The solid-solution strengthening effect for the single and simultaneous addition of Zr and Si on the compression strength and the creep property in Ti-10Al-2Nb based alloys (at%) with an equiaxed a phase designed by us, was investigated. The compression strengths of these alloys were investigated at temperatures between room temperature and 650 degrees C. The largest solid-solution strengthening effect was obtained for the alloys with Zr and Si simultaneously added, followed by alloys with the single addition of 2Zr or 0.5Si. For the same amounts of addition elements, the solid-solution strengthening effect of Si was larger than that of Zr. This was attributed to the larger atomic size misfit between Ti and Si than that of between Ti and Zr. A creep test was conducted for Ti-10Al-2Nb-2Zr and Ti-10Al-2Nb-2Zr-0.5Si within a temperature range of 550-650 degrees C under an applied stress between 137 and 240 MPa. The alloy with Si exhibited a longer creep life for all tested conditions due to a large solid-solution strengthening effect and high compression strength.The deformation mechanisms of the compressive deformation and tensile creep deformation were analyzed using an Arrhenius-type equation. Considering the stress exponent and activation energy, the deformation mechanism of the compressive deformation was identified as low-temperature power-law creep controlled by dislocation core diffusion. While, the deformation mechanism of the creep deformation was identified as high-temperature power-law creep controlled through lattice diffusion.

リンク情報
DOI
https://doi.org/10.1016/j.msea.2019.04.031
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000469893400007&DestApp=WOS_CPL
ID情報
  • DOI : 10.1016/j.msea.2019.04.031
  • ISSN : 0921-5093
  • eISSN : 1873-4936
  • ORCIDのPut Code : 59281767
  • Web of Science ID : WOS:000469893400007

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