2010年4月
Atomic simulation of grain boundary sliding in Co/Cu two-phase bicrystals
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
- ,
- ,
- 巻
- 527
- 号
- 10-11
- 開始ページ
- 2629
- 終了ページ
- 2636
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.msea.2009.12.025
- 出版者・発行元
- ELSEVIER SCIENCE SA
Molecular dynamic simulations of grain boundary sliding were performed on Cu/Cu one-phase bicrystal and Co/Cu two-phase bicrystal models. The grain boundary sliding and migration behaviors of the Co/Cu bicrystals were different from those of the Cu/Cu bicrystals, and the Co/Cu sliding behavior was less related to the free volume, than that of Cu/Cu. In the Co/Cu(2 2 1) grain boundary model, the pore structure units were formed on the Cu side very near the Co/Cu interface, not just at the interface. The onset of grain boundary sliding in the Co/Cu bicrystals was due to the uncorrelated atomic shuffling induced by the pore structure units. (C) 2009 Elsevier B.V. All rights reserved.
- リンク情報
- ID情報
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- DOI : 10.1016/j.msea.2009.12.025
- ISSN : 0921-5093
- J-Global ID : 201002203368201945
- Web of Science ID : WOS:000276137600024