2010年7月
Deformation behavior of an ultrafine grained two phase Co-Cu alloy processed by electrodeposition
SCRIPTA MATERIALIA
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- 巻
- 63
- 号
- 1
- 開始ページ
- 132
- 終了ページ
- 135
- 記述言語
- 英語
- 掲載種別
- 研究論文(学術雑誌)
- DOI
- 10.1016/j.scriptamat.2010.03.035
- 出版者・発行元
- PERGAMON-ELSEVIER SCIENCE LTD
An ultrafine grained two phase Co-Cu alloy was processed by electrodeposition. The two phase Co-Cu alloy was composed of hexagonal close-packed Co-rich grains and face-centered cubic Cu-rich grains. The two phase Co-Cu alloy exhibited a high strain rate sensitivity of 0.137 and low activation volume of 3.3 b(Co)(3) or 3.1 b(Cu)(3) at room temperature. It is suggested, from the results of an atomic simulation of the Co/Cu grain boundary, that the unique deformation characteristics can be attributed to Co/Cu heterogeneous grain boundaries. (C) 2010 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
- リンク情報
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- DOI
- https://doi.org/10.1016/j.scriptamat.2010.03.035
- J-GLOBAL
- https://jglobal.jst.go.jp/detail?JGLOBAL_ID=201002292495455878
- Web of Science
- https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000277898900035&DestApp=WOS_CPL
- ID情報
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- DOI : 10.1016/j.scriptamat.2010.03.035
- ISSN : 1359-6462
- J-Global ID : 201002292495455878
- Web of Science ID : WOS:000277898900035