論文

査読有り
1998年4月

Electrical property on copper thin film with chromium under-layer

THIN SOLID FILMS
  • H Nakai
  • ,
  • K Fudaba
  • ,
  • K Shinzawa
  • ,
  • M Hashimoto

317
1-2
開始ページ
202
終了ページ
205
記述言語
英語
掲載種別
研究論文(学術雑誌)
出版者・発行元
ELSEVIER SCIENCE SA

Temperature coefficient of resistance (TCR) of as-deposited and annealed atomic beam-deposited polycrystalline copper films of 20 nm with chromium under-layer on SiOx substrate layers was measured. The copper resistivity for various chromium thicknesses was in situ measured during copper deposition. The TCR of the as-deposited films decreases with the chromium thickness to reach a minimum value at about 5 nm. The minimum TCR value for the annealed copper films exists at the chromium thickness equal to about 1 nm. When chromium thickness is less than 2 nm the annealing markedly decreases the TCR of the copper film. (C) 1998 Elsevier Science S.A.

Web of Science ® 被引用回数 : 7

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Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000074517700048&DestApp=WOS_CPL

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