Papers

Peer-reviewed
2010

Profile measurement based on spectral interferometer with multi-wavelength back-propagation methods

OPTICAL METROLOGY AND INSPECTION FOR INDUSTRIAL APPLICATIONS
  • Kohei Otsuki
  • ,
  • Samuel Choi
  • ,
  • Osami Sasaki
  • ,
  • Takamasa Suzuki

Volume
7855
Number
First page
26
Last page
Language
English
Publishing type
Research paper (international conference proceedings)
DOI
10.1117/12.870987
Publisher
SPIE-INT SOC OPTICAL ENGINEERING

The multi-wavelength back-propagation (MWB) method enables to determine precisely the optical path different (OPD) longer than the optical wavelength from detecting the amplitude and phase of the interference signal for the multiple wavelengths. In this study, we demonstrate a 1-dimensional thickness profile measurement by the MWB and sinusoidal phase modulation (SPM) technique with a spectral interferometer. The OPD for the front and rear reflecting surfaces of a glass film with the thickness of 100 mu m are measured. The thickness profile is successfully measured with repeatability of 2 nm estimated from a standard error between 9 repeatedly-measured profiles.

Link information
DOI
https://doi.org/10.1117/12.870987
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000287663000022&DestApp=WOS_CPL
ID information
  • DOI : 10.1117/12.870987
  • ISSN : 0277-786X
  • Web of Science ID : WOS:000287663000022

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