論文

2008年

Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additives

SOLDERING & SURFACE MOUNT TECHNOLOGY
  • Toshihiro Miyake
  • ,
  • Masaru Ishida
  • ,
  • Satoshi Inagaki

20
4
開始ページ
28
終了ページ
36
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1108/09540910810902688
出版者・発行元
EMERALD GROUP PUBLISHING LTD

Purpose - The paper aims to focus on lowering the soldering temperature of ionic compound free soldering using 9,10-dihydroanthracene as a hydrocarbon flux.
Design/methodology/approach - The ability of 9,10-dihydroanthracene to reduce cupric oxide in the presence of peroxides including tert-butyl peroxybenzoate, tertbutyl cumyl peroxide, tertbutyl peroxide was investigated. The applicability of 9,10-dihydroanthracene in the presence of peroxides as ionic compound free flux reagents was experimentally examined in the soldering of pre-oxidized copper electrodes under practical conditions.
Findings - The ability of 9,10-dihydroanthracene for the reduction of cupric oxide powder under argon atmosphere at 300 degrees C for 120 s was found to be improved in the presence of tert-butyl peroxybenzoate. The highest reducing ability of 9,10-dihydroanthracene in the presence of tertbutyl peroxybenzoate among the peroxides was in agreement with the lowest homolytical O-O bond dissociation energies of the peroxides calculated by the theoretical calculation. 9,10-Dihydroanthracene in the presence of tert butyl peroxybenzoate showed the highest soldering efficiency under practical conditions (soldering temperature: 300 degrees C) and sufficient reliability in the environmental testing.
Originality/value - The findings demonstrate that peroxide additives improve the applicability of 9,10-dihydroanthracene as ion free soldering even under practical conditions.

リンク情報
DOI
https://doi.org/10.1108/09540910810902688
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000259966900004&DestApp=WOS_CPL
ID情報
  • DOI : 10.1108/09540910810902688
  • ISSN : 0954-0911
  • eISSN : 1758-6836
  • Web of Science ID : WOS:000259966900004

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