論文

査読有り
2004年11月

Silver nanoparticle formation in thin oxide layer on silicon by silver-negative-ion implantation for Coulomb blockade at room temperature

APPLIED SURFACE SCIENCE
  • H Tsuji
  • ,
  • N Arai
  • ,
  • T Matsumoto
  • ,
  • K Ueno
  • ,
  • Y Gotoh
  • ,
  • K Adachi
  • ,
  • H Kotaki
  • ,
  • J Ishikawa

238
1-4
開始ページ
132
終了ページ
137
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1016/j.apsusc.2004.05.194
出版者・発行元
ELSEVIER SCIENCE BV

Formation of silver nanoparticles formed by silver negative-ion implantation in a thin SiO2 layer and its I-V characteristics were investigated for development single electron devices. In order to obtain effective Coulomb blockade phenomenon at room temperature, the isolated metal nanoparticles should be in very small size and be formed in a thin insulator layer such as gate oxide on the silicon substrate. Therefore, conditions of a fine particles size, high particle density and narrow distribution should be controlled at their formation without any electrical breakdown of the thin insulator layer. We have used a negative-ion implantation technique with an advantage of "charge-up free" for insulators, with which no breakdown of thin oxide layer on Si was obtained. In the I-V characteristics with An electrode, the current steps were observed with a voltage interval of about 0.12 V. From the step voltage the corresponded capacitance was calculated to be 0.7 aF. In one nanoparticle system, this value of capacitance could be given by a nanoparticle of about 3 nm in diameter. This consideration is consistent to the measured particle size in the cross-sectional TEM observation. Therefore, the observed I-V characteristics with steps are considered to be Coulomb staircase by the Ag nanoparticles. (C) 2004 Elsevier B.V. All rights reserved.

リンク情報
DOI
https://doi.org/10.1016/j.apsusc.2004.05.194
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000224655200025&DestApp=WOS_CPL
ID情報
  • DOI : 10.1016/j.apsusc.2004.05.194
  • ISSN : 0169-4332
  • Web of Science ID : WOS:000224655200025

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