論文

査読有り
2003年9月

Microencapsulation of linoleic acid with low- and high-molecular-weight components of soluble soybean polysaccharide and its oxidation process

BIOSCIENCE BIOTECHNOLOGY AND BIOCHEMISTRY
  • Fang, X
  • ,
  • Y Watanabe
  • ,
  • S Adachi
  • ,
  • Y Matsumura
  • ,
  • T Mori
  • ,
  • H Maeda
  • ,
  • A Nakamura
  • ,
  • R Matsuno

67
9
開始ページ
1864
終了ページ
1869
記述言語
英語
掲載種別
研究論文(学術雑誌)
DOI
10.1271/bbb.67.1864
出版者・発行元
TAYLOR & FRANCIS LTD

Soluble soybean polysaccharide (SSPS) was fractionated into its low- (LMW) and high-molecular-weight (HMW) components to test their antioxidative and emulsifying properties. Linoleic acid was emulsified with an aqueous solution of SSPS, HMW, a mixture of LMW or HMW with maltodextrin, or maltodextrin alone. The emulsions prepared with SSPS, HWM and the mixture of HMW with maltodextrin were stable. These emulsions were spay-dried to produce microcapsules. The encapsulated linoleic acid was oxidized at 37degreesC and at various levels of relative humidity. Linoleic acid encapsulated with the mixture of LMW with maltodextrin or HMW was stable to oxidation, and this stability increased as the weight fraction of LMW in the mixture was increased. The LMW components also had high DPPH-radical scavenging activity. These results indicate that LMW played an important role in suppressing or retarding the oxidation of linoleic acid encapsulated with SSPS. The oxidative stability of linoleic acid encapsulated with a mixture of the LMW and HMW components was high at low and high relative humidity, but not at intermediate levels of relative humidity.

リンク情報
DOI
https://doi.org/10.1271/bbb.67.1864
J-GLOBAL
https://jglobal.jst.go.jp/detail?JGLOBAL_ID=200902224506512511
CiNii Articles
http://ci.nii.ac.jp/naid/110002694319
PubMed
https://www.ncbi.nlm.nih.gov/pubmed/14519968
Web of Science
https://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=JSTA_CEL&SrcApp=J_Gate_JST&DestLinkType=FullRecord&KeyUT=WOS:000185727700002&DestApp=WOS_CPL
ID情報
  • DOI : 10.1271/bbb.67.1864
  • ISSN : 0916-8451
  • eISSN : 1347-6947
  • J-Global ID : 200902224506512511
  • CiNii Articles ID : 110002694319
  • PubMed ID : 14519968
  • Web of Science ID : WOS:000185727700002

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