HONMA Hideo

J-GLOBAL         Last updated: Mar 14, 2016 at 14:17
 
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Name
HONMA Hideo
Affiliation
Kanto Gakuin University
Section
College of Engineering, Department of Applied Material and Life Science
Job title
Professor
Degree
Doctor of ENG(Osaka Prefecture University)

Research Areas

 
 

Education

 
 
 - 
1968
Graduate School, Division of Engineering, Kanto Gakuin University
 
 
 - 
1965
Faculty of Engineering, Kanto Gakuin University
 

Misc

 
Ryoichi Kimizuka, Hisayuki Toda, Tetsuro Eda, Kazuki Kishimoto, Reisei Oh, Hideo Honma, and Osamu Takai
J. Electrochem. Soc.      2015   [Refereed]
Makoto Kohtoku, Hideo Honma and Osamu Takai
J. Electrochem. Soc      2014   [Refereed]
Copper Metallization on Photosensitive-Crystallization Glass Surface
Plating & Surface Finishing   89(2), 42-26    2002
Distribution of shosphrous in Electroless Nickel-Phosphorous Deposites
Electrochemical Society of Japan   70(7), 511-514    2002
Microfabrication Using Plating Technologies
The Surface Finishing Society of Japan   52(1) 66-67   2001
The Surface Finishing Society of Japan   52(1) 130-134   2001
Hiroyuki INABA, Shuhei MIURA, Hideo HONMA
The Surface Finishing Society of Japan   52(2) 222-227   2001
Taiji NISHIWAKI, Hideo HONMA
Journal of Japan Institute of Electronics Packaging   4(2) 128-132   2001
Katsuhiko TASHIRO, Yukio HASHIMOTO, Hideo HONMA
Journal of The Surface Finishing Society of Japan   52(3) 289-293   2001
Yukio HASHIMOTO, Yoshiharu FUKUHARA, Kenji WATANABE, Katsuhiko TASHIRO, Hideo HONMA
The Surface Finishing Society of Japan   52(3) 294-297   2001

Works

 
Fabrication of Micro Bumps Using Electroless Nickel Plating
1999 - 2000
Formation of Integrated Circuit Interconnection Using Copper Electroplating
1999 - 2000
Via-filling Using Copper Electroplating
1999 - 2000

Research Grants & Projects

 
Fabrication of wiring on semiconductor by Electrocopper Plating
Bump FORMATION ON LSI by Disulfiteaurate Complex
Electroless Nickel Plating for Nano-fabrication