2015年6月1日
Chip-level microassembly of XYZ-microstage with large displacements
IEEJ Transactions on Sensors and Micromachines
- ,
- ,
- 巻
- 135
- 号
- 6
- 開始ページ
- 236
- 終了ページ
- 237
- DOI
- 10.1541/ieejsmas.135.236
© 2015 The Institute of Electrical Engineers of Japan. This letter reports a novel chip-level microassembly technology to construct an XYZ-microstage with large displacements into X-, Y-, Z-directions. The main parts of the XYZ-microstage, consisting of a comb-drive XY-microstage, two comb-drive Z-microstages and a bottom silicon base substrate, are assembled together by using micro manipulators. Small conductive mechanical springs are used to realize the electrical connections between XY-microstage and Z-microstages. It is demonstrated that the fabricated XYZ-microstage based on microassembly technology can achieve displacements of 25.2 μm in X direction, 20.4 μm in Y direction and 58.5 μm in Z direction, respectively.
- リンク情報
- ID情報
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- DOI : 10.1541/ieejsmas.135.236
- ISSN : 1341-8939
- eISSN : 1347-5525
- SCOPUS ID : 84937157062