INOUE Masahiro

J-GLOBAL         Last updated: Jan 11, 2020 at 02:44
 
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Name
INOUE Masahiro
Affiliation
Gunma University
Job title
Lecturer, Advanced Scientific Research Leaders Development Unit
Degree
Dr.(Engnieering)(Osaka University)

Research Areas

 
 

Education

 
 
 - 
1993
Graduate School, Division of Integrated Science and Engineering, Tokyo Institute of Technology
 

Awards & Honors

 
2005
Outstanding Technical Paper Award (International Conference of Electronics Packaging 2004)
 

Misc

 
Effect of microstructural evolution on electrical conductivity of electrically conductive adhesives containing Ag micro-fillers
M. Inoue, H. Muta, S. Yamanaka, J. Liu
Proc. International Conference on Electronics Packaging (ICEP) 2012   676-680   2012
M. Inoue, H. Muta, S. Yamanaka, J. Liu
Proc. 4th Electronics System Integration Technologies Conference (ESTC) 2012   27.1   2012
M. Inoue, Y. Tada, Y. Hayashi, H. Muta, T. Tokumaru
Proc. The 14th International Conference on Electronic Materials and Packaging (EMAP2012)   302-305   2012
A Smart Shirt Made with Conductive Ink and Conductive Foam for the Measurement of Electrocardiogram Signals with Unipolar Precordial Leads
Y. Tada, Y. Amano, T. Sato, S. Saito, M. Inoue
Fibers   3 463-477   2015
Development of Bimodal Electrically Conductive Pates with Ag Micro- and Nano-fillers for Printing Stretchable E-textile Systems
M. Inoue, Y. Itabashi, Y. Tada
Proc. EMPC2015   S4_2_4_id107   2015

Books etc

 
Mechanical Behavior of Reactively Hot-Pressed Aluminide Matrix Composites
Mat. Res. Soc. Symp. Proc.   1997   
Microstructure and Mechanical Properties of Reactive-hot-Pressed Nickel Aluminide Matrix Composites
Proc. 5th Japan International SAMPE Symp.   1997   
Strength and fracture behavior of aluminide matrix composites with ceramic fibers
Mat. Res. Soc. Symp. Proc.   1999   

Conference Activities & Talks

 
Effect of microstructural evolution on electrical conductivity of electrically conductive adhesives containing Ag micro-fillers
International Conference on Electronics Packaging 2012   2012   
Microstructural Evolution in Electrically Conductive Adhesives Containing Ag Micro-fillers During Curing and Post-annealing
4th Electronics System Integration Technologies Conference (ESTC2012)   2012   
Design of Electrically Conductive Adhesive Materials Based on Matrix Resin Chemistry
The 11th International Symposium on Microelectronics on Packaging (ISMP2012)   2012   
Development of Highly Conductive Inks for Smart Textiles
The 14th International Conference on Electronic Materials and Packaging (EMAP2012)   2012   
Development of Novel Functional Hybrid Materials for Microsystems Packaging
International Symposium by ASRLD Unit   2013   

Association Memberships

 
 

Research Grants & Projects

 
必須項目の入力がありません

Patents

 
Electrically Conductive Pastes
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