論文

査読有り
2019年10月

On Delay Elements in Boundary Scan Cells for Delay Testing of 3D IC Interconnection

IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
  • Toshiaki Satoh
  • ,
  • Hiroyuki Yotsuyanagi
  • ,
  • Masaki Hashizume

記述言語
掲載種別
研究論文(国際会議プロシーディングス)
DOI
10.1109/3DIC48104.2019.9058908

© 2019 IEEE. For testing delay faults in 3D IC interconnection, we have proposed a DFT (Design-for-Testability) method for TSVs using a modified boundary scan circuit with embedded Time-To-Digital Converter (TDCBS). A TDCBS cell has a delay element to form a delay line. In this paper, for improving delay resolution, delay gates that have small propagation delay time are investigated and implemented as a delay line. In order to prevent pulse shrinking of transition signal through a delay line, the proposed cell is designed to reduce the difference in transition delay between the delay for rising transition and for falling transition. The measurement results for an experimental chip show the effectiveness of our new design.

リンク情報
DOI
https://doi.org/10.1109/3DIC48104.2019.9058908
Scopus
https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85084110950&origin=inward
Scopus Citedby
https://www.scopus.com/inward/citedby.uri?partnerID=HzOxMe3b&scp=85084110950&origin=inward
ID情報
  • DOI : 10.1109/3DIC48104.2019.9058908
  • SCOPUS ID : 85084110950

エクスポート
BibTeX RIS